AND Gate, CMOS, PDIP14,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDIP-T14 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | AND GATE |
最大I(ol) | 0.004 A |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
Prop。Delay @ Nom-Sup | 30 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
GD74HCT08 | GD74HC08J | GD74HC08D | SLVU2.8-4 | GD74HCT08D | GD74HCT08J | GD54HCT08J | GD54HC08J | |
---|---|---|---|---|---|---|---|---|
描述 | AND Gate, CMOS, PDIP14, | AND Gate, CMOS, CDIP14, | AND Gate, CMOS, PDSO14, | 2.8V TVS Array For ESD and Latch-Up Protection | AND Gate, CMOS, PDSO14, | AND Gate, CMOS, CDIP14, | AND Gate, CMOS, CDIP14, | AND Gate, CMOS, CDIP14, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknown | unknown | unknown | - | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-PDIP-T14 | R-XDIP-T14 | R-PDSO-G14 | - | R-PDSO-G14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | - | AND GATE | AND GATE | AND GATE | AND GATE |
最大I(ol) | 0.004 A | 0.004 A | 0.004 A | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
端子数量 | 14 | 14 | 14 | - | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -55 °C | -55 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | SOP | - | SOP | DIP | DIP | DIP |
封装等效代码 | DIP14,.3 | DIP14,.3 | SOP14,.25 | - | SOP14,.25 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | - | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
电源 | 5 V | 2/6 V | 2/6 V | - | 5 V | 5 V | 5 V | 2/6 V |
Prop。Delay @ Nom-Sup | 30 ns | 23 ns | 23 ns | - | 30 ns | 30 ns | 36 ns | 27 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | NO | NO | NO | - | NO | NO | NO | NO |
表面贴装 | NO | NO | YES | - | YES | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | - | 1 | 1 | - | - |
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