MINITEK™ Pin-in-Paste
DESCRIPTION
Minitek is FCI’s brand for board-to-board and
wire/cable-to-board connectors in 2.00 mm pitch.
The Minitek product range includes PCB Card Connectors,
Shrouded and Unshrouded headers
and IDC/CTW receptacles.
FCI is adding five new series of Minitek Headers
to its product range, dedicated to Pin-in-Paste soldering proces-
ses. This brochure gives additional information
for the correct use of Minitek PIP connectors in the
application process.
Housing design:
Standoffs raise the housing body slightly
above the PCB surface and thus allow the
molten solder paste to flow freely from its printed
position into the board hole and around the pin.
The standoffs are correctly positioned for a good
solder paste deposit around the pin. Please respect the stencil
design guidelines below in order to avoid paste deposit around
the standoffs.
Pin length:
The connector lead length beyond the bottom
of the PCB is shorter than for traditional TMT products.
Thus, the risk of pushing out the solder paste when inserting
the pin into the PCB hole is very much limited. The solder
paste
will not stick on the pin tip or even fall off completely, but stays
around the pin for free flow during soldering.
FCI uses a solder tail length of 2 ± 0.2 mm for Minitek Headers
for a standard PCB of 1.6 mm thickness.
Packaging:
For combining SMT and TMT components
not only in the soldering process, but also in the assembly
process, FCI proposes a choice of pick-and-place
packaging for PIP connectors.
The most common part numbers are available
in tape-on-reel packaging, all others in tube.
Pin-in-Paste
Pin-in-Paste (PiP) technology allows the use of TMT
products in SMT manufacturing processes.
The connectors are automatically or manually placed
on the board, then soldered in the same operation
as the SMT components. Despite this, the mechanical strenght
of the TMT soldering is maintained
– still an important requirement for connectors nowadays in many
industrial or automotive applications.
CONNECTOR DESIGN
In order to achieve optimum soldering results, FCI
launches dedicated Pin-in-Paste connectors in the basics+ pro-
duct range. These connectors are fully adapted
to Pin-in-Paste processing in all aspects, including plastic mate-
rial, housing design, pin length, and packaging.
Plastic material:
Minitek PIP headers are moulded
in high temperature thermoplastic and are able
to withstand exposure to 260°C peak temperature
for 30 seconds maximum in a convection, infra-red
or vapour phase reflow oven.
TECHNICAL DATA
Unshrouded / Stacking:
Materials
Housing: high temperature thermoplastic
Colour: black
Flammability rating: UL 94 V-O
Pin: Phosphor bronze
Plating: Gold and tin over 1,27 µm nickel
Current rating: 1A continuous
Insulation resistance: 1000 Mq min.
Dielectric withstanding voltage: 650 V
-55°C to +125°C
Compatible with IR reflow soldering
processes
This product is RoHS compatible according
to the European Union Directive 2002/95/IEC
File no. E66906
File no. LR46923
Product drawing: by 8-digit base
part number
Product specification: DPS-12-011
and GS-12-163
Application specification: TA-895
Reflow profile: TA-842
Shrouded:
Materials
Housing: high temperature thermoplastic
Colour: cream
Flammability rating: UL 94 V-O
Pin: Phosphor bronze
Plating: Gold and tin over 1,27 µm nickel
Current rating: 2A continuous
Insulation resistance: 1000 Mq min.
Dielectric withstanding voltage: 650 V
-40°C to +125°C
Compatible with IR reflow soldering
processes
This product is RoHS compatible according
to the European Union Directive 2002/95/IEC
File no. E66906
File no. LR46923
Product drawing: by 8-digit base
part number
Product specification: DPS-12-011
and GS-12-163
Application specification: TA-896
Reflow profile: TA-842
Electrical performance
Electrical performance
Mechanical performance
Pin retention: 7 N min.
Operating
temperature range
Processing information
RoHS information
Reference information
Mechanical performance
Pin retention: 7 N min.
Operating
temperature range
Processing information
RoHS information
Reference information
MINITEK™ Pin-in-Paste
APPLICATION DESIGN GUIDELINES
For application in a Pin-in-Paste process, FCI recommends the application design guidelines below.
STENCIL DESIGN:
The stencil design is crucial for a good solder joint. It determines
the quantity of paste and the position of the paste print
on the board. Each PCB hole has its own stencil aperture
with enough spacing in between in order to have separate
solder deposits.
This prevents solder robbing from one hole to another and
guarantees the correct quantity of solder paste for each hole.
The print position is slightly asymmetrical so as to optimise
the flow of molten solder paste
PASTE APPLICATION:
The quantity of paste for each hole depends on the soldering
process parameters and the degree of hole filling.
For the squeegee, FCI recommends a 45° angle.
You can use a smaller angle for an even greater degree of hole
filling. The squeegee moves in parallel with the shorter sides
of the stencil apertures.
BOARD LAYOUT:
Please use a hole of 0.8 mm (right angle headers) or 0.85 mm
(vertical headers) ± 0.05 mm for an optimum paste deposit.
For automatic pick-and-place, lean towards the upper end
of the tolerance.
Refer also to TA-895 (for Headers right angle Shrouded and
Unshrouded) et TA-896 (for Headers vertical Shrouded and
Unshrouded).
Extract from application note TA-895
MINITEK™ Pin-in-Paste
PART NUMBER
8-Digit Base Part Number
Plating
Pin style
No. of positions
per row
Packaging
LF
Minitek Unshrouded Header
10075024
= Vertical
10072353
= Right angle
G
= 0.76 µm (30µ") Gold on contact area,
2-6 µm (50-150µ") Tin on solder side
F
= Gold flash on mating area,
2-6 µm (50-150µ") Tin on solder side
02
to
25
U
= Tube without cap from 04 to 25 pos
A
= Tape availability on request
Pin
Style
Mating side
mm
Solder side
mm
01
4.00
2.00
5-Digit Base Part Number
Plating
Pin style
No. of positions
per row
Packaging
Stack
Height
LF
Minitek Unshrouded Stacking Header
59362
= Vertical Stacking Header
02
to
25
XXX
= mm
Specify mm (i.e., 037=03.7)
in 0.1 mm increments
8-Digit Base Part Number
Plating
Pin style
Total no.
of positions
Packaging
LF
Minitek Shrouded Header
10075025
= Vertical
10072354
= Right angle
G
= 0.76 µm (30µ") Gold on contact area,
2-6 µm (50-150µ") Tin on solder side
F
= Gold flash on mating area,
2-6 µm (50-150µ") Tin on solder side
04
to
50
U
= Tube without cap from 08 to 50 pos
A
= Tape availability on request
Pin
Style
Mating side
mm
Solder side
mm
01
4.00
2.00
BASICS+ SERVICE PROGRAM
Minitek is a part of the
Basics+
product range.
Basics+
program built around 2.54 mm and 2 mm pitch
connectors for board-to-board, wire-to-board and
cable-to-board applications.
Basics+
makes the entire product design-in-process very simple,
with easy-to-use product selection, technical hot line, fast sample
service, and core range products. Included are established,
proven brands such as BergStik, Dubox, Quickie, Minitek and
BergCon PV.
FCI - Americas : 1 (800) 237 2374 - Europe : 33 1 39 49 21 83 - Asia/Pacific : 65 6549 6666
www.fciconnect.com
CDC-MINIPIP-02/07-E
FEMINIPIP0207E
G
= 0.76 µm (30µ") Gold on contact area,
0.76 µm (30µ") Gold on tail
T
= 0.76 µm (30µ") Gold on contact area,
2.54 µm (0.100µ") 100 % Matte tin on tail
Pin style
OAL
Solder side mm
22
24
26
28
30
32
34
36
38
40
08.2
09.6
10.2
11.8
13.5
14.1
15.6
17.1
19.1
21.1
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
U
= Tube without cap from 04 to 25 pos
A
= Tape availability on request
NXP MCU
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