Memory IC, 2MX40, CMOS, PSMA72,
| 参数名称 | 属性值 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 最长访问时间 | 60 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PSMA-N72 |
| 内存密度 | 83886080 bit |
| 内存宽度 | 40 |
| 端子数量 | 72 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2MX40 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SIMM |
| 封装等效代码 | SSIM72 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 1024 |
| 座面最大高度 | 25.4 mm |
| 最大待机电流 | 0.02 A |
| 最大压摆率 | 1.12 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | SINGLE |
| Base Number Matches | 1 |
| GMM7402000DSG-60 | GMM7402000DS-60 | GMM7402000DS-70 | GMM7402000DS-80 | GMM7402000DSG-70 | GMM7402000DSG-80 | |
|---|---|---|---|---|---|---|
| 描述 | Memory IC, 2MX40, CMOS, PSMA72, | Memory IC, 2MX40, CMOS, PSMA72, | Memory IC, 2MX40, CMOS, PSMA72, | Memory IC, 2MX40, CMOS, PSMA72, | Memory IC, 2MX40, CMOS, PSMA72, | Memory IC, 2MX40, CMOS, PSMA72, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Is Samacsys | N | N | N | N | N | N |
| 最长访问时间 | 60 ns | 60 ns | 70 ns | 80 ns | 70 ns | 80 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 | R-PSMA-N72 |
| 内存密度 | 83886080 bit | 83886080 bit | 83886080 bit | 83886080 bit | 83886080 bit | 83886080 bit |
| 内存宽度 | 40 | 40 | 40 | 40 | 40 | 40 |
| 端子数量 | 72 | 72 | 72 | 72 | 72 | 72 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 2MX40 | 2MX40 | 2MX40 | 2MX40 | 2MX40 | 2MX40 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
| 封装等效代码 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| 座面最大高度 | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm | 25.4 mm |
| 最大待机电流 | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| 最大压摆率 | 1.12 mA | 1.12 mA | 1.02 mA | 0.92 mA | 1.02 mA | 0.92 mA |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
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