OT PLD, CQCC68
参数名称 | 属性值 |
厂商名称 | NXP(恩智浦) |
包装说明 | QCCJ, |
Reach Compliance Code | unknown |
最大时钟频率 | 50 MHz |
JESD-30 代码 | S-CQCC-J68 |
长度 | 24.065 mm |
专用输入次数 | 9 |
I/O 线路数量 | 24 |
端子数量 | 68 |
最高工作温度 | 75 °C |
最低工作温度 | |
组织 | 9 DEDICATED INPUTS, 24 I/O |
输出函数 | MIXED |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCJ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
可编程逻辑类型 | OT PLD |
认证状态 | Not Qualified |
座面最大高度 | 4.83 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL EXTENDED |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 24.065 mm |
PML2552-35KA-T | PML2552-35A | PML2552-35A-T | PML2552-35KA | PML2552-50A | PML2552-50A-T | PML2552-50KA-T | PML2552-50KA | |
---|---|---|---|---|---|---|---|---|
描述 | OT PLD, CQCC68 | OT PLD, PQCC68 | OT PLD, PQCC68 | OT PLD, CQCC68 | OT PLD, PQCC68 | OT PLD, PQCC68 | OT PLD, CQCC68 | OT PLD, CQCC68 |
包装说明 | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, | QCCJ, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最大时钟频率 | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 35 MHz | 35 MHz | 35 MHz | 35 MHz |
JESD-30 代码 | S-CQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-CQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-CQCC-J68 | S-CQCC-J68 |
长度 | 24.065 mm | 24.23 mm | 24.23 mm | 24.065 mm | 24.23 mm | 24.23 mm | 24.065 mm | 24.065 mm |
专用输入次数 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
I/O 线路数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
组织 | 9 DEDICATED INPUTS, 24 I/O | 9 DEDICATED INPUTS, 24 I/O | 9 DEDICATED INPUTS, 24 I/O | 9 DEDICATED INPUTS, 24 I/O | 9 DEDICATED INPUTS, 24 I/O | 9 DEDICATED INPUTS, 24 I/O | 9 DEDICATED INPUTS, 24 I/O | 9 DEDICATED INPUTS, 24 I/O |
输出函数 | MIXED | MIXED | MIXED | MIXED | MIXED | MIXED | MIXED | MIXED |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ | QCCJ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.83 mm | 4.57 mm | 4.57 mm | 4.83 mm | 4.57 mm | 4.57 mm | 4.83 mm | 4.83 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 24.065 mm | 24.23 mm | 24.23 mm | 24.065 mm | 24.23 mm | 24.23 mm | 24.065 mm | 24.065 mm |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
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