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SMC11002372FLF13

产品描述Fixed Resistor, Metal Glaze/thick Film, 1W, 23700ohm, 350V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小161KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准  
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SMC11002372FLF13概述

Fixed Resistor, Metal Glaze/thick Film, 1W, 23700ohm, 350V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512, ROHS COMPLIANT

SMC11002372FLF13规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
包装说明MELF, 2512
Reach Compliance Codecompliant
Is SamacsysN
构造Cylindrical
JESD-609代码e3
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
最低工作温度-55 °C
封装直径3.1 mm
封装长度6.35 mm
封装形状RECTANGULAR PACKAGE
封装形式MELF
包装方法TR, 13 INCH
额定功率耗散 (P)1 W
额定温度70 °C
电阻23700 Ω
电阻器类型FIXED RESISTOR
尺寸代码2512
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Matte Tin (Sn)
端子形状WRAPAROUND
容差1%
工作电压350 V
Base Number Matches1

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SMC Series
Cylindrical Surface Mount
Metal Glaze™
Compliant-Terminal Resistors
Lead free, RoHS compliant
Uses standard IRC 2512, 3610 solder pads
Ideal for automotive and other harsh thermal applications
Uncompromising Metal Glaze™ performance gives excellent
surge performance
Capped terminals provide mechanical compliance-relief from
board vs. component TCE mismatch
Electrical Data
IRC
Type
SMC-1
SMC-2
Industry
Standard
Footprint
2512
3610
Power Rating
(Watts)
1.0 @ 70°C
2.0 @ 25°C
1.33 @ 70°C
Resistance
Range
(Ohms)
1.0 to 10
Ω
10 - 1 MΩ
1.0 to 10
Ω
10 - 1 MΩ
Tolerance
(±%)
1
5
1, 2, 5
5
1, 2, 5
TCR
(±ppm/°C)
200
100
200
100
Operating
Voltage
(V)
350
500
Maximum
Voltage
(V)
700
1000
Notes:
1
For tolerances below ±1%, please contact factory.
Environmental Data
Characteristics
Temperature Coefficient (ppm/°C)
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Operating Temperature
Maximum Change
As specified
±2.0% +0.01Ω
(R
10Ω)
±1.0% +0.01Ω
(R > 10Ω)
±1.0% +0.01Ω
(R
10Ω)
±0.5% +0.01Ω
(R > 10Ω)
±1.0% +0.01Ω
(R
10Ω)
±0.5% +0.01Ω
(R > 10Ω)
±1.0% +0.01Ω
(R
10Ω)
±0.5% +0.01Ω
(R > 10Ω)
±1.0% +0.01Ω
(R
10Ω)
±0.5% +0.01Ω
(R > 10Ω)
95% minimum coverage
±1.0% +0.01Ω
(R
10Ω)
±0.5% +0.01Ω
(R > 10Ω)
±1.0% +0.01Ω
(R
10Ω)
±0.5% +0.01Ω
(R > 10Ω)
±1% +0.01
no mechanical damage
±1% +0.01
no mechanical damage
Test Method
MIL-PRF-55342E Par 4.7.9
(-55°C to +125°C)
MIL-PRF-55342E Par 4.7.3
(-65°C to +150°C)
MIL-PRF-55342E Par 4.7.4
(-65°C @ working voltage)
MIL-PRF-55342E Par 4.7.5
(2.5 x
PxR for 5 seconds)
MIL-PRF-55342E Par 4.7.6
(+150°C for 100 hours)
MIL-PRF-55342E Par 4.7.7
(Reflow soldered to board @ 260°C for 10 seconds)
MIL-STD-202, Method 208
(245°C for 5 seconds)
MIL-PRF-55342E Par 4.7.8
(10 cycles, total 240 hours)
MIL-PRF-55342E Par 4.7.10
(2000 hours @ 70°C intermittent)
1200 gram push from underside of
mounted chip for 60 seconds
Chip mounted in center of 90mm long board,
deflected 5mm so as to exert pull on chip contacts
for 10 seconds
-55°C to +150°C
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
SMC Series Issue March 2010 Sheet 1 of 3
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
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