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SMC1501132FLF13

产品描述Fixed Resistor, Metal Glaze/thick Film, 1W, 11300ohm, 350V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2512, CHIP, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小275KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准
下载文档 详细参数 全文预览

SMC1501132FLF13概述

Fixed Resistor, Metal Glaze/thick Film, 1W, 11300ohm, 350V, 1% +/-Tol, 50ppm/Cel, Surface Mount, 2512, CHIP, ROHS COMPLIANT

SMC1501132FLF13规格参数

参数名称属性值
是否Rohs认证符合
包装说明, 2512
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
JESD-609代码e3
安装特点SURFACE MOUNT
端子数量2
封装形状RECTANGULAR PACKAGE
包装方法TR, 13 INCH
额定功率耗散 (P)1 W
额定温度70 °C
电阻11300 Ω
电阻器类型FIXED RESISTOR
尺寸代码2512
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数50 ppm/°C
端子面层Matte Tin (Sn)
端子形状WRAPAROUND
容差1%
工作电压350 V
Base Number Matches1

文档预览

下载PDF文档
SMC SERIES
METAL GLAZETM GENERAL PURPOSE
SURFACE MOUNT, COMPLIANT TERMINAL
·
Capped terminals provide mechanical compliance – relief from
·
board vs component TCE mismatch
Applications – Ideal for automotive and other
harsh thermal applications
Uncompromising MetalGlazeTM performance gives
excellent surge performance
Lead-free, RoHS compliant
Use standard IRC 2512, 3610 solder pads
·
·
·
SMC SPECIFICATIONS:
Size
Code
F
H
Industry
Footprint
2512
3610
IRC
Type
SMC-1
SMC-2
Maximum
Power Rating
1W @ 70°C
2W @ 70°C
Working
Voltage
350
500
Maximum
Voltage
650
1000
Resistance
Range (Ω)
0.1 to 0.99
1.0 to 2.0M
20 to 348K
0.1 to 0.99
1 to 2.0M
Tolerance
(±%)
1,2,5
1,2,5
0.5,1,2,5
1,2,5
1,2,5
TCR
(ppm/°C)
100
50,100
50, 100
100
50,100
Product
Category
Low range
Standard
Tight Tolerance
Low Range
Standard
SMC PERFORMANCE CHARACTERISTICS
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specified
±0.5% +0.01 ohm
±0.25% +0.01 ohm
Test Method
MIL-PRF-55342E Par 4.7.9 (-55°C +125°C)
MIL-PRF-55342E Par 4.7.3 (-65°C +150°C, 5 cycles)
MIL-PRF-55342E Par 4.7.4 (-65°C @ working voltage)
±0.25%+0.01ohm(R</-100K Ohm
±1%+0.01ohm(R</-100K Ohm MIL-PRF-55342E Par 4.7.5 (2.5 x SQRT (PXR) FOR 5 seconds)
+0.5 +0.01 ohm
MIL-PRF-55342E Par 4.7.6 (+150°C for 100 hours)
±0.25% 0.01 ohm
MIL-PRF-55342E Par 4.7.7
(Reflow soldered to board at 260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
95% minimum coverage
±0.5% +0.01 ohm
±0.5% +0.01 ohm
±1% +0.01 ohm
no mechanical damage
±1% + 0.01 ohm
no mechanical damage
MIL-PRF-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-PRF-55342E Par 4.7.10 (2000 hour at 70°C intermittent)
1200 gram push from underside of mounted chip for 60 seconds
Chip mounted in center of 90mm long board, deflected 5mm so as to
exert pull on chip contacts for 10 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
WIREWOUND AND FILM TECHNOLOGIES DIVISION
736 Greenway Road
Boone, North Carolina 28607-1860
Tel: 828-264-8861
Fax: 828-264-8866
www.irctt.com
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