HCT SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8
| 参数名称 | 属性值 |
| 功能数量 | 3 |
| 端子数量 | 8 |
| 最小工作温度 | -40 Cel |
| 最大工作温度 | 125 Cel |
| 额定供电电压 | 5 |
| 最小供电/工作电压 | 4.5 V |
| 最大供电/工作电压 | 5.5 V |
| 加工封装描述 | 3 MM, PLASTIC, SOT-505-2, TSSOP-8 |
| each_compli | Yes |
| 欧盟RoHS规范 | Yes |
| 中国RoHS规范 | Yes |
| 状态 | Active |
| 逻辑IC类型 | INVERTER |
| sub_category | Gates |
| 系列 | HCT |
| jesd_30_code | S-PDSO-G8 |
| jesd_609_code | e4 |
| load_capacitance__cl_ | 50 pF |
| max_i_ol_ | 0.0040 Am |
| moisture_sensitivity_level | 1 |
| 输入数 | 1 |
| 包装材料 | PLASTIC/EPOXY |
| ckage_code | TSSOP |
| ckage_equivalence_code | TSSOP8,.16 |
| 包装形状 | SQUARE |
| 包装尺寸 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| cking_method | TAPE AND REEL |
| eak_reflow_temperature__cel_ | 260 |
| wer_supplies__v_ | 5 |
| ._delay_nom_su | 48 ns |
| 传播延迟TPD | 48 ns |
| qualification_status | COMMERCIAL |
| schmitt_trigge | YES |
| seated_height_max | 1.1 mm |
| 表面贴装 | YES |
| 工艺 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子涂层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子间距 | 0.6500 mm |
| 端子位置 | DUAL |
| ime_peak_reflow_temperature_max__s_ | 30 |
| length | 3 mm |
| width | 3 mm |
| 74HC3G14 | 74HC3G14DC | 74HC3G14DP | 74HCT3G14 | 74HCT3G14DC | 74HCT3G14DP | |
|---|---|---|---|---|---|---|
| 描述 | HCT SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8 | HCT SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8 | HCT SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8 | HCT SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8 | HCT SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8 | HCT SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | - | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | - | TSSOP, TSSOP8,.12,20 | TSSOP, TSSOP8,.16 | - | TSSOP, TSSOP8,.12,20 | TSSOP, TSSOP8,.16 |
| Reach Compliance Code | - | unknow | unknow | - | unknow | unknow |
| JESD-30 代码 | - | R-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-G8 |
| 负载电容（CL） | - | 50 pF | 50 pF | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | INVERTER | INVERTER | - | INVERTER | INVERTER |
| 最大I（ol） | - | 0.004 A | 0.004 A | - | 0.004 A | 0.004 A |
| 最高工作温度 | - | 125 °C | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSSOP | TSSOP | - | TSSOP | TSSOP |
| 封装等效代码 | - | TSSOP8,.12,20 | TSSOP8,.16 | - | TSSOP8,.12,20 | TSSOP8,.16 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | - | TAPE AND REEL | TAPE AND REEL | - | TAPE AND REEL | TAPE AND REEL |
| 电源 | - | 2/6 V | 2/6 V | - | 5 V | 5 V |
| Prop。Delay @ Nom-Su | - | 38 ns | 38 ns | - | 48 ns | 48 ns |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 施密特触发器 | - | YES | YES | - | YES | YES |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS |
| 端子节距 | - | 0.5 mm | 0.635 mm | - | 0.5 mm | 0.635 mm |
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