Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PQCC44,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | QCCJ, LDCC44,.7SQ |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 位大小 | 8 |
| CPU系列 | 8051 |
| JESD-30 代码 | S-PQCC-J44 |
| JESD-609代码 | e0 |
| 端子数量 | 44 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC44,.7SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 128 |
| ROM（单词） | 4096 |
| ROM可编程性 | UVPROM |
| 速度 | 16 MHz |
| 最大压摆率 | 25 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| P87C550EBAA-T | P87C550EBKA | P87C550EBN | P87C550EFAA-T | P87C550EFFA | P87C550EFN | P80C550EBAA-T | P87C550EBFA | P83C550EBN | P83C550EFN | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CQCC44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, 8051 CPU, 16MHz, CMOS, PQCC44, | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 16MHz, CMOS, CDIP40 | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PDIP40 | Microcontroller, 8-Bit, MROM, 8051 CPU, 16MHz, CMOS, PDIP40 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP40,.6 | QCCJ, LDCC44,.7SQ | DIP, DIP40,.6 | DIP, DIP40,.6 | DIP, DIP40,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 | 8051 |
| JESD-30 代码 | S-PQCC-J44 | S-XQCC-J44 | R-PDIP-T40 | S-PQCC-J44 | R-XDIP-T40 | R-PDIP-T40 | S-PQCC-J44 | R-XDIP-T40 | R-PDIP-T40 | R-PDIP-T40 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 44 | 44 | 40 | 44 | 40 | 40 | 44 | 40 | 40 | 40 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | DIP | QCCJ | DIP | DIP | QCCJ | DIP | DIP | DIP |
| 封装等效代码 | LDCC44,.7SQ | LDCC44,.7SQ | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 | LDCC44,.7SQ | DIP40,.6 | DIP40,.6 | DIP40,.6 |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 | 128 |
| ROM（单词） | 4096 | 4096 | 4096 | 4096 | 4096 | 4096 | - | 4096 | 4096 | 4096 |
| 速度 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| 最大压摆率 | 25 mA | 25 mA | 25 mA | 35 mA | 35 mA | 35 mA | 25 mA | 25 mA | 25 mA | 35 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | NO | NO | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | QUAD | QUAD | DUAL | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
| ROM可编程性 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | - | UVPROM | MROM | MROM |
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