74HC181D概述

4-bit arithmetic logic unit

74HC181D规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	Philips Semiconductors (NXP Semiconductors N.V.)
包装说明	SOP, SOP24,.4
Reach Compliance Code	unknow
JESD-30 代码	R-PDSO-G24
JESD-609代码	e0
逻辑集成电路类型	ARITHMETIC LOGIC UNIT
端子数量	24
最高工作温度	85 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	SOP
封装等效代码	SOP24,.4
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
电源	2/6 V
认证状态	Not Qualified
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	1.27 mm
端子位置	DUAL

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INTEGRATED CIRCUITS

DATA SHEET

For a complete data sheet, please also download:

•

The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications

•

The IC06 74HC/HCT/HCU/HCMOS Logic Package Information

•

The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines

74HC/HCT181

4-bit arithmetic logic unit

Product speciﬁcation

Supersedes data of September 1993

File under Integrated Circuits, IC06

1998 Jun 10

74HC181D相似产品对比

	74HC181D	74HC181	74HC181N	74HC181N3	74HCT181	74HCT181D	74HCT181N	74HCT181N3
描述	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit	4-bit arithmetic logic unit
是否Rohs认证	不符合	-	不符合	不符合	-	不符合	不符合	不符合
厂商名称	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	-	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)	Philips Semiconductors (NXP Semiconductors N.V.)
包装说明	SOP, SOP24,.4	-	DIP, DIP24,.6	DIP, DIP24,.3	-	SOP, SOP24,.4	DIP, DIP24,.6	DIP, DIP24,.3
Reach Compliance Code	unknow	-	unknow	unknow	-	unknow	unknow	unknow
JESD-30 代码	R-PDSO-G24	-	R-PDIP-T24	R-PDIP-T24	-	R-PDSO-G24	R-PDIP-T24	R-PDIP-T24
JESD-609代码	e0	-	e0	e0	-	e0	e0	e0
逻辑集成电路类型	ARITHMETIC LOGIC UNIT	-	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	-	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT	ARITHMETIC LOGIC UNIT
端子数量	24	-	24	24	-	24	24	24
最高工作温度	85 °C	-	85 °C	85 °C	-	85 °C	85 °C	85 °C
最低工作温度	-40 °C	-	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	SOP	-	DIP	DIP	-	SOP	DIP	DIP
封装等效代码	SOP24,.4	-	DIP24,.6	DIP24,.3	-	SOP24,.4	DIP24,.6	DIP24,.3
封装形状	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	-	IN-LINE	IN-LINE	-	SMALL OUTLINE	IN-LINE	IN-LINE
电源	2/6 V	-	2/6 V	2/6 V	-	5 V	5 V	5 V
认证状态	Not Qualified	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
表面贴装	YES	-	NO	NO	-	YES	NO	NO
技术	CMOS	-	CMOS	CMOS	-	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	-	THROUGH-HOLE	THROUGH-HOLE	-	GULL WING	THROUGH-HOLE	THROUGH-HOLE
端子节距	1.27 mm	-	2.54 mm	2.54 mm	-	1.27 mm	2.54 mm	2.54 mm
端子位置	DUAL	-	DUAL	DUAL	-	DUAL	DUAL	DUAL

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