HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16
| 参数名称 | 属性值 |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最小工作温度 | -40 Cel |
| 最大工作温度 | 125 Cel |
| 额定供电电压 | 4.5 |
| 最小供电/工作电压 | 2 V |
| 最大供电/工作电压 | 6 V |
| 加工封装描述 | PLASTIC, SOT-403-1, TSSOP-16 |
| each_compli | Yes |
| 欧盟RoHS规范 | Yes |
| 中国RoHS规范 | Yes |
| 状态 | Active |
| 逻辑IC类型 | J-K FLIP-FLOP |
| sub_category | FF/Latches |
| 系列 | HC/UH |
| 最大-最小频率 | 24 MHz |
| jesd_30_code | R-PDSO-G16 |
| jesd_609_code | e4 |
| load_capacitance__cl_ | 50 pF |
| max_frequency_nom_su | 2.00E7 Hz |
| max_i_ol_ | 0.0040 Am |
| moisture_sensitivity_level | 1 |
| 位数 | 2 |
| 输出极性 | COMPLEMENTARY |
| 包装材料 | PLASTIC/EPOXY |
| ckage_code | TSSOP |
| ckage_equivalence_code | TSSOP16,.25 |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| eak_reflow_temperature__cel_ | 260 |
| wer_supplies__v_ | 2/6 |
| 传播延迟TPD | 265 ns |
| qualification_status | COMMERCIAL |
| seated_height_max | 1.1 mm |
| 表面贴装 | YES |
| 工艺 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子涂层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子间距 | 0.6500 mm |
| 端子位置 | DUAL |
| ime_peak_reflow_temperature_max__s_ | 30 |
| 触发器类型 | NEGATIVE EDGE |
| length | 5 mm |
| width | 4.4 mm |
| 74HC112 | 74HC112DB | 74HC112N | 74HC112PW | 74HCT112DB | 74HCT112 | 74HCT112N | 74HCT112D | 74HCT112PW | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16 | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16 | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16 | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16 | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16 | 8-Line To 3-Line Priority Encoders 16-SO -40 to 85 | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16 | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16 | HC/UH SERIES, DUAL NEGATIVE EDGE TRIGGERED J-K FLIP-FLOP, COMPLEMENTARY OUTPUT, PDSO16 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | - | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | - | 16 | 16 | 16 |
| 表面贴装 | YES | YES | NO | YES | YES | - | NO | YES | YES |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | - | THROUGH-HOLE | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL |
| 触发器类型 | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | - | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 |
| 厂商名称 | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | - | SSOP, SSOP16,.3 | DIP, DIP16,.3 | TSSOP, TSSOP16,.25 | SSOP, SSOP16,.3 | - | DIP, DIP16,.3 | SOP, SOP16,.25 | TSSOP, TSSOP16,.25 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow | - | unknow | unknow | unknow |
| JESD-30 代码 | - | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | - | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 |
| 负载电容（CL） | - | 50 pF | 50 pF | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | - | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | - | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
| 最大频率@ Nom-Su | - | 20000000 Hz | 20000000 Hz | 20000000 Hz | 20000000 Hz | - | 20000000 Hz | 20000000 Hz | 20000000 Hz |
| 最大I（ol） | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A | - | 0.004 A | 0.004 A | 0.004 A |
| 最高工作温度 | - | 125 °C | 125 °C | 125 °C | 85 °C | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | SSOP | DIP | TSSOP | SSOP | - | DIP | SOP | TSSOP |
| 封装等效代码 | - | SSOP16,.3 | DIP16,.3 | TSSOP16,.25 | SSOP16,.3 | - | DIP16,.3 | SOP16,.25 | TSSOP16,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, SHRINK PITCH | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | - | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | - | 2/6 V | 2/6 V | 2/6 V | 5 V | - | 5 V | 5 V | 5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS |
| 端子节距 | - | 0.635 mm | 2.54 mm | 0.635 mm | 0.635 mm | - | 2.54 mm | 1.27 mm | 0.635 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
