DECLDL-2-11概述

Active Delay Line, 2-Func, 1-Tap, Complementary Output, ECL, 0.325 INCH HEIGHT, DIP-12/8

DECLDL-2-11规格参数

参数名称	属性值
厂商名称	Engineered Components Co
零件包装代码	DIP
包装说明	QIP, DIP12,.7
针数	12/8
Reach Compliance Code	unknown
Is Samacsys	N
其他特性	BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED
系列	100K
JESD-30 代码	R-XDIP-P8
长度	22.225 mm
逻辑集成电路类型	ACTIVE DELAY LINE
功能数量	2
抽头/阶步数	1
端子数量	8
最高工作温度	85 °C
最低工作温度
输出特性	OPEN-EMITTER
输出极性	COMPLEMENTARY
封装主体材料	UNSPECIFIED
封装代码	QIP
封装等效代码	DIP12,.7
封装形状	RECTANGULAR
封装形式	IN-LINE
电源	-4.5 V
可编程延迟线	NO
Prop。Delay @ Nom-Sup	11 ns
认证状态	Not Qualified
座面最大高度	8.255 mm
表面贴装	NO
技术	ECL
温度等级	OTHER
端子形式	PIN/PEG
端子节距	2.54 mm
端子位置	DUAL
总延迟标称（td）	11 ns
宽度	17.78 mm
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

DECLDL-2-11相似产品对比

	DECLDL-2-11	DECLDL-2-13.5	DECLDL-2-13	DECLDL-2-10	DECLDL-2-10.5	DECLDL-2-12.5	DECLDL-2-14	DECLDL-2-14.5	DECLDL-2-17
描述	Active Delay Line, 2-Func, 1-Tap, Complementary Output, ECL, 0.325 INCH HEIGHT, DIP-12/8	Active Delay Line, 2-Func, 1-Tap, Complementary Output, ECL, 0.325 INCH HEIGHT, DIP-12/8	Active Delay Line, 2-Func, 1-Tap, Complementary Output, ECL, 0.325 INCH HEIGHT, DIP-12/8	Active Delay Line, 2-Func, 1-Tap, Complementary Output, ECL, 0.325 INCH HEIGHT, DIP-12/8	Active Delay Line, 2-Func, 1-Tap, Complementary Output, ECL, 0.325 INCH HEIGHT, DIP-12/8	Active Delay Line, 2-Func, 1-Tap, Complementary Output, ECL, 0.325 INCH HEIGHT, DIP-12/8	Active Delay Line, 2-Func, 1-Tap, Complementary Output, ECL, 0.325 INCH HEIGHT, DIP-12/8	Active Delay Line, 2-Func, 1-Tap, Complementary Output, ECL, 0.325 INCH HEIGHT, DIP-12/8	Active Delay Line, 2-Func, 1-Tap, Complementary Output, ECL, 0.325 INCH HEIGHT, DIP-12/8
零件包装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
包装说明	QIP, DIP12,.7	QIP, DIP12,.7	QIP, DIP12,.7	QIP, DIP12,.7	QIP, DIP12,.7	QIP, DIP12,.7	QIP, DIP12,.7	QIP, DIP12,.7	QIP, DIP12,.7
针数	12/8	12/8	12/8	12/8	12/8	12/8	12/8	12/8	12/8
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
其他特性	BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED	BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED	BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED	BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED	BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED	BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED	BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED	BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED	BURNED-IN TO LEVEL B OF MIL-STD-883; TYP. ICC = 155MA; MAX TEMP. COEFF. CAPTURED
系列	100K	100K	100K	100K	100K	100K	100K	100K	100K
JESD-30 代码	R-XDIP-P8	R-XDIP-P8	R-XDIP-P8	R-XDIP-P8	R-XDIP-P8	R-XDIP-P8	R-XDIP-P8	R-XDIP-P8	R-XDIP-P8
长度	22.225 mm	22.225 mm	22.225 mm	22.225 mm	22.225 mm	22.225 mm	22.225 mm	22.225 mm	22.225 mm
逻辑集成电路类型	ACTIVE DELAY LINE	ACTIVE DELAY LINE	ACTIVE DELAY LINE	ACTIVE DELAY LINE	ACTIVE DELAY LINE	ACTIVE DELAY LINE	ACTIVE DELAY LINE	ACTIVE DELAY LINE	ACTIVE DELAY LINE
功能数量	2	2	2	2	2	2	2	2	2
抽头/阶步数	1	1	1	1	1	1	1	1	1
端子数量	8	8	8	8	8	8	8	8	8
最高工作温度	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
输出特性	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER	OPEN-EMITTER
输出极性	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY	COMPLEMENTARY
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装代码	QIP	QIP	QIP	QIP	QIP	QIP	QIP	QIP	QIP
封装等效代码	DIP12,.7	DIP12,.7	DIP12,.7	DIP12,.7	DIP12,.7	DIP12,.7	DIP12,.7	DIP12,.7	DIP12,.7
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
电源	-4.5 V	-4.5 V	-4.5 V	-4.5 V	-4.5 V	-4.5 V	-4.5 V	-4.5 V	-4.5 V
可编程延迟线	NO	NO	NO	NO	NO	NO	NO	NO	NO
Prop。Delay @ Nom-Sup	11 ns	13.5 ns	13 ns	10 ns	10.5 ns	12.5 ns	14 ns	14.5 ns	17 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	8.255 mm	8.255 mm	8.255 mm	8.255 mm	8.255 mm	8.255 mm	8.255 mm	8.255 mm	8.255 mm
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	ECL	ECL	ECL	ECL	ECL	ECL	ECL	ECL	ECL
温度等级	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
端子形式	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
端子节距	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
总延迟标称（td）	11 ns	13.5 ns	13 ns	10 ns	10.5 ns	12.5 ns	14 ns	14.5 ns	17 ns
宽度	17.78 mm	17.78 mm	17.78 mm	17.78 mm	17.78 mm	17.78 mm	17.78 mm	17.78 mm	17.78 mm
Base Number Matches	1	1	1	1	1	1	1	1	1
厂商名称	Engineered Components Co	Engineered Components Co	Engineered Components Co	Engineered Components Co	Engineered Components Co	-	-	-	-

DECLDL-2-11

DECLDL-2-11概述

DECLDL-2-11规格参数

文档预览

DECLDL-2-11相似产品对比

推荐资源