REVISIONS
LTR
A
DESCRIPTION
Add device type 03. Add one vendor, CAGE 64155. Make changes to table I
and throughout.
Changes in accordance with 5962-R271-92.
Changes in accordance with 5962-R016-97.
Changes in accordance with 5962-R253-97.
Drawing updated to reflect current requirements. - ro
DATE (YR-MO-DA)
91-02-14
APPROVED
M. A. FRYE
B
C
D
E
92-11-20
96-10-23
97-04-08
02-06-20
M. A. FRYE
R. MONNIN
R. MONNIN
R. MONNIN
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
RICK C. OFFICER
E
1
E
2
E
3
E
4
E
5
E
6
E
7
E
8
E
9
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
CHARLES E. BESORE
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, PRECISION VOLTAGE
REFERENCE, 2.5 VOLT, MONOLITHIC SILICON
DRAWING APPROVAL DATE
87-11-17
AMSC N/A
REVISION LEVEL
E
SIZE
A
SHEET
CAGE CODE
67268
1 OF
9
5962-86861
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E377-02
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-86861
01
P
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number
580S, 1503
580T, 1503A
580U
Circuit function
Precision 2.5 V reference (1%)
Precision 2.5 V reference (0.4%)
Precision 2.5 V reference (0.4%)
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
P
X
Y
Descriptive designator
GDIP1-T8 or CDIP2-T8
See figure 1
MACY1-X3
Terminals
8
3
3
Package style
Dual in-line
Can
Can
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage (V
CC
) ....................................................................... 40 V dc
Maximum power dissipation (P
D
):
Case P ..........................................................................................
Case X ..........................................................................................
Case Y ..........................................................................................
Storage temperature range ..............................................................
Lead temperature (soldering, 10 seconds) ......................................
Junction temperature (T
J
) ................................................................
Thermal resistance, junction-to-case (
θ
JC
):
Case P ..........................................................................................
Case X ..........................................................................................
Case Y ..........................................................................................
Thermal resistance, junction-to-ambient (
θ
JA
):
Case X ..........................................................................................
Case Y ..........................................................................................
600 mW 1/
350 mW
1.0 W
-65°C to +150°C
+300°C
+175°C
See MIL-STD-1835
30°C/W
15°C/W
150°C/W
120°C/W
_____
1/ Derate case P at 4.8 mW/°C above +25°C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86861
SHEET
E
2
1.4 Recommended operating conditions.
Supply voltage (V
CC
) ....................................................................... +4.5 V dc to +30 V dc
Ambient operating temperature range (T
A
) ...................................... -55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed
in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in
the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -- List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86861
SHEET
E
3
TABLE I. Electrical performance characteristics.
Conditions
-55°C
≤
T
A
≤
+125°C
V
CC
= +15 V, I
L
= 0 mA
unless otherwise specified
Quiescent current
I
CC
1
01,02
03
2,3
Output voltage
V
OUT
T
A
= +25°C
1/
1
12
Line regulation
VR
LINE1
V
CC
= 7 V to 30 V,
T
A
= +25°C
VR
LINE2
V
CC
= 4.5 V to 7 V,
T
A
= +25°C
Load regulation
VR
LOAD
I
L
= 0 mA to 10 mA,
T
A
= +25°C
Output voltage
temperature
coefficient
TCV
OUT
1/
2,3
01
02
03
±25
±11
±4.5
mV
1
1
All
All
02,03
01,02
03
01,02
03
All
2.475
2.49
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Unit
Max
2.0
1.5
2.0
2.525
2.51
±6
±2
±3
±1
±10
mV
mV
V
mA
1/
Measurements of output voltage temperature coefficient is acceptable for output voltage across temperature
measurement (subgroups 2 and 3) or visa versa.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86861
SHEET
E
4
C
L
Symbol
A
φb
φb1
φD
φD1
φe
e1
F
k
k1
L
L1
L2
Min
0.115
0.016
---
0.209
0.178
Inches
Max
0.150
0.019
0.021
0.230
0.195
0.100 T.P.
0.050 T.P.
---
0.036
0.028
0.500
---
0.250
45° T.P.
0.030
0.046
0.048
---
0.050
---
0.91
0.71
12.70
---
6.35
Min
2.92
0.41
---
5.31
4.52
Millimeters
Max
3.81
0.48
0.53
5.84
4.95
2.54 T.P.
1.27 T.P.
0.76
1.17
1.22
---
1.27
Notes
1,4
1,4
2
2
3
1
1
α
NOTES:
1. (Three leads)
φb
applies between L
1
and L
2
.
φb1
applies between L
2
and 0.5 inch (12.70 mm) from seating plane.
2.
3.
4.
5.
Diameter is uncontrolled in L
1
and beyond 0.5 inch (12.70 mm) from seating plane.
Leads having maximum diameter 0.019 inch (0.48 mm) measured in gauging plane 0.054 inch (1.4 mm) + 0.001 inch
(0.03 mm) – 0.000 inch (0.00 mm) below the seating plane of the device are within 0.007 inch (0.18 mm) of their
true positions relative to a maximum-width tab.
Measured from maximum diameter of the actual device.
All leads – increased maximum limit by 0.003 inch (0.08 mm) when hot solder dip finish is applied.
The U.S. government preferred system of measurement is the metric SI system. However, since this item was
originally designed using inch-pound units of measurement, in the event of conflict between the metric and
inch-pound units, the inch-pound units shall take precedence.
FIGURE 1. Case outline.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86861
SHEET
E
5
嵌入式系统
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