Single-Ended Multiplexer, 3 Func, 16 Channel, CQFP96, 1.320 X 1.320 X 0.200 INCH, CERAMIC, QFP-96
参数名称 | 属性值 |
厂商名称 | Cobham Semiconductor Solutions |
零件包装代码 | QFP |
包装说明 | QFF, |
针数 | 96 |
Reach Compliance Code | unknown |
Is Samacsys | N |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | S-CQFP-F96 |
标称负供电电压 (Vsup) | -15 V |
信道数量 | 16 |
功能数量 | 3 |
端子数量 | 96 |
最大通态电阻 (Ron) | 3000 Ω |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QFF |
封装形状 | SQUARE |
封装形式 | FLATPACK |
认证状态 | Not Qualified |
筛选级别 | MIL-PRF-38534 Class H |
座面最大高度 | 5.08 mm |
标称供电电压 (Vsup) | 15 V |
表面贴装 | YES |
最长断开时间 | 2000 ns |
最长接通时间 | 1500 ns |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | QUAD |
总剂量 | 300k Rad(Si) V |
Base Number Matches | 1 |
ACT8502 | ACT8502-I | ACT8502-C | ACT8502-T | |
---|---|---|---|---|
描述 | Single-Ended Multiplexer, 3 Func, 16 Channel, CQFP96, 1.320 X 1.320 X 0.200 INCH, CERAMIC, QFP-96 | Single-Ended Multiplexer, 6 Func, 16 Channel, CQFP96, 1.320 X 1.320 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, CERAMIC, QFP-96 | Single-Ended Multiplexer, 6 Func, 16 Channel, CQFP96, 1.320 X 1.320 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, CERAMIC, QFP-96 | Single-Ended Multiplexer, 6 Func, 16 Channel, CQFP96, 1.320 X 1.320 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, CERAMIC, QFP-96 |
厂商名称 | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions | Cobham Semiconductor Solutions |
零件包装代码 | QFP | QFP | QFP | QFP |
包装说明 | QFF, | QFF, | QFF, | QFF, |
针数 | 96 | 96 | 96 | 96 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Is Samacsys | N | N | N | N |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | S-CQFP-F96 | S-CQFP-F96 | S-CQFP-F96 | S-CQFP-F96 |
标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
信道数量 | 16 | 16 | 16 | 16 |
功能数量 | 3 | 6 | 6 | 6 |
端子数量 | 96 | 96 | 96 | 96 |
最大通态电阻 (Ron) | 3000 Ω | 3000 Ω | 3000 Ω | 3000 Ω |
最高工作温度 | 125 °C | 85 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | -40 °C | - | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QFF | QFF | QFF | QFF |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
表面贴装 | YES | YES | YES | YES |
最长断开时间 | 2000 ns | 2000 ns | 2000 ns | 2000 ns |
最长接通时间 | 1500 ns | 1500 ns | 1500 ns | 1500 ns |
温度等级 | MILITARY | INDUSTRIAL | COMMERCIAL | MILITARY |
端子形式 | FLAT | FLAT | FLAT | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
Base Number Matches | 1 | 1 | 1 | 1 |
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