Error Detection And Correction Circuit, CMOS Series, 16-Bit, CMOS, PQFP100, MQFP-100
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | TEMIC |
包装说明 | MQFP-100 |
Reach Compliance Code | unknown |
Is Samacsys | N |
其他特性 | MIL-STD-883/S |
系列 | CMOS |
JESD-30 代码 | R-PQFP-G100 |
JESD-609代码 | e0 |
逻辑集成电路类型 | ERROR DETECTION AND CORRECTION CIRCUIT |
位数 | 16 |
功能数量 | 1 |
端子数量 | 100 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QFP |
封装等效代码 | QFP100,.7X.9 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
电源 | 5 V |
传播延迟(tpd) | 31 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class B |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.635 mm |
端子位置 | QUAD |
Base Number Matches | 1 |
MMFR-29C516E-31/883 | MMFR-29C516E-31 | SMFR-29C516E-31 | SMFR-29C516E-31/883 | |
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描述 | Error Detection And Correction Circuit, CMOS Series, 16-Bit, CMOS, PQFP100, MQFP-100 | Error Detection And Correction Circuit, CMOS Series, 16-Bit, CMOS, PQFP100, MQFP-100 | Error Detection And Correction Circuit, CMOS Series, 16-Bit, CMOS, PQFP100, MQFP-100 | Error Detection And Correction Circuit, CMOS Series, 16-Bit, CMOS, PQFP100, MQFP-100 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | TEMIC | TEMIC | TEMIC | TEMIC |
包装说明 | MQFP-100 | MQFP-100 | MQFP-100 | MQFP-100 |
Reach Compliance Code | unknown | unknown | unknown | unknow |
系列 | CMOS | CMOS | CMOS | CMOS |
JESD-30 代码 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 | R-PQFP-G100 |
JESD-609代码 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | ERROR DETECTION AND CORRECTION CIRCUIT | ERROR DETECTION AND CORRECTION CIRCUIT | ERROR DETECTION AND CORRECTION CIRCUIT | ERROR DETECTION AND CORRECTION CIRCUIT |
位数 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 100 | 100 | 100 | 100 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | QFP | QFP |
封装等效代码 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.7X.9 | QFP100,.7X.9 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
电源 | 5 V | 5 V | 5 V | 5 V |
传播延迟(tpd) | 31 ns | 31 ns | 31 ns | 31 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
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