Quad 2-input multiplexer 3-state
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SSOP, SSOP16,.3 |
| Reach Compliance Code | unknow |
| JESD-30 代码 | R-PDSO-G16 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 最大I(ol) | 0.006 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 包装方法 | TUBE |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Su | 33 ns |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |

| 74HC257DB | 74HC257 | 74HC257D | 74HC257N | 74HC257PW | 74HCT257D | 74HCT257N | 74HCT257PW | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Quad 2-input multiplexer 3-state | Quad 2-input multiplexer 3-state | Quad 2-input multiplexer 3-state | Quad 2-input multiplexer 3-state | Quad 2-input multiplexer 3-state | HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16 | Quad 2-input multiplexer 3-state | Quad 2-input multiplexer 3-state |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SSOP, SSOP16,.3 | - | SOP, SOP16,.25 | - | TSSOP, TSSOP16,.25 | SOP, SOP16,.25 | DIP, DIP16,.3 | TSSOP, TSSOP16,.25 |
| Reach Compliance Code | unknow | - | unknow | unknown | unknow | unknow | unknown | unknow |
| JESD-30 代码 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 |
| 负载电容(CL) | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 最大I(ol) | 0.006 A | - | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
| 功能数量 | 4 | - | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | - | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | - | SOP | DIP | TSSOP | SOP | DIP | TSSOP |
| 封装等效代码 | SSOP16,.3 | - | SOP16,.25 | DIP16,.3 | TSSOP16,.25 | SOP16,.25 | DIP16,.3 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | TUBE | - | BULK PACK | BULK PACK | TUBE | BULK PACK | BULK PACK | TUBE |
| 电源 | 2/6 V | - | 2/6 V | 2/6 V | 2/6 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Su | 33 ns | - | 33 ns | - | 33 ns | 45 ns | - | 45 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | - | YES | NO | YES | YES | NO | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | - | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 0.635 mm | - | 1.27 mm | 2.54 mm | 0.635 mm | 1.27 mm | 2.54 mm | 0.635 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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