Latch/flip-flop
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SSOP, SSOP20,.3 |
| Reach Compliance Code | unknow |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | D LATCH |
| 最大I(ol) | 0.024 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装等效代码 | SSOP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 电源 | 5 V |
| 最大电源电流(ICC) | 27 mA |
| Prop。Delay @ Nom-Su | 14 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |

| 74ALS373DB | 74ALS373 | 74ALS373D | 74ALS374 | 74ALS373N | 74ALS374DB | 74ALS374D | 74ALS374N | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Latch/flip-flop | Latch/flip-flop | Latch/flip-flop | Latch/flip-flop | Latch/flip-flop | Latch/flip-flop | Latch/flip-flop | Latch/flip-flop |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | SSOP, SSOP20,.3 | - | SOP, SOP20,.4 | - | DIP, DIP20,.3 | SSOP, SSOP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 |
| Reach Compliance Code | unknow | - | unknow | - | unknow | unknow | unknow | unknow |
| JESD-30 代码 | R-PDSO-G20 | - | R-PDSO-G20 | - | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 |
| JESD-609代码 | e0 | - | e0 | - | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | D LATCH | - | D LATCH | - | D LATCH | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 最大I(ol) | 0.024 A | - | 0.024 A | - | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 功能数量 | 1 | - | 1 | - | 1 | 8 | 8 | 8 |
| 端子数量 | 20 | - | 20 | - | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | - | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | - | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | - | SOP | - | DIP | SSOP | SOP | DIP |
| 封装等效代码 | SSOP20,.3 | - | SOP20,.4 | - | DIP20,.3 | SSOP20,.3 | SOP20,.4 | DIP20,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE | - | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE |
| 电源 | 5 V | - | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 最大电源电流(ICC) | 27 mA | - | 27 mA | - | 27 mA | 31 mA | 31 mA | 31 mA |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | - | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | YES | - | NO | YES | YES | NO |
| 技术 | TTL | - | TTL | - | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | - | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | - | GULL WING | - | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.635 mm | - | 1.27 mm | - | 2.54 mm | 0.635 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | - | DUAL | DUAL | DUAL | DUAL |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved