EEPROM, 8KX8, 200ns, Parallel, CMOS, CDIP28,
参数名称 | 属性值 |
厂商名称 | Xicor Inc |
Reach Compliance Code | unknown |
Is Samacsys | N |
最长访问时间 | 200 ns |
JESD-30 代码 | R-GDIP-T28 |
JESD-609代码 | e0 |
内存密度 | 65536 bit |
内存集成电路类型 | EEPROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 28 |
字数 | 8192 words |
字数代码 | 8000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 8KX8 |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
编程电压 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 5.9 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 15.24 mm |
Base Number Matches | 1 |
5962-8751404XX | 5962-8751404ZX | 5962-8751405ZX | 5962-8751405YX | 5962-8751405XX | 5962-8751404YX | X28C64J-20T3 | |
---|---|---|---|---|---|---|---|
描述 | EEPROM, 8KX8, 200ns, Parallel, CMOS, CDIP28, | EEPROM, 8KX8, 200ns, Parallel, CMOS, CDFP28, CERAMIC, FP-28 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CDFP28, CERAMIC, FP-28 | EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, | EEPROM, 8KX8, 250ns, Parallel, CMOS, CDIP28, | EEPROM, 8KX8, 200ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 | EEPROM, 8KX8, 200ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 200 ns | 200 ns | 250 ns | 250 ns | 250 ns | 200 ns | 200 ns |
JESD-30 代码 | R-GDIP-T28 | R-CDFP-F28 | R-CDFP-F28 | R-CQCC-N32 | R-GDIP-T28 | R-CQCC-N32 | R-PQCC-J32 |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 32 | 28 | 32 | 32 |
字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
封装代码 | DIP | DFP | DFP | QCCN | DIP | QCCN | QCCJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | FLATPACK | FLATPACK | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.9 mm | 3.3 mm | 3.3 mm | 3.05 mm | 5.9 mm | 3.05 mm | 3.56 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL |
端子形式 | THROUGH-HOLE | FLAT | FLAT | NO LEAD | THROUGH-HOLE | NO LEAD | J BEND |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD |
厂商名称 | Xicor Inc | Xicor Inc | Xicor Inc | - | - | Xicor Inc | Xicor Inc |
JESD-609代码 | e0 | e4 | - | e0 | e0 | e0 | - |
端子面层 | TIN LEAD | GOLD | - | TIN LEAD | TIN LEAD | TIN LEAD | - |
宽度 | 15.24 mm | - | - | 11.425 mm | 15.24 mm | 11.425 mm | 11.43 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
包装说明 | - | CERAMIC, FP-28 | CERAMIC, FP-28 | - | - | CERAMIC, LCC-32 | PLASTIC, LCC-32 |
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