2-input NAND gate
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | TSSOP, TSSOP5/6,.08 |
| Reach Compliance Code | unknow |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e3 |
| 逻辑集成电路类型 | NAND GATE |
| 最大I(ol) | 0.008 A |
| 湿度敏感等级 | 1 |
| 端子数量 | 5 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP5/6,.08 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 电源 | 5 V |
| Prop。Delay @ Nom-Su | 10 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |

| 74AHCT1G00GW | 74AHC1G00GV | 74AHCT1G00GV | 74AHC1G00 | 74AHC1G00GW | 74AHCT1G00 | |
|---|---|---|---|---|---|---|
| 描述 | 2-input NAND gate | 2-input NAND gate | 2-input NAND gate | 2-input NAND gate | AHC SERIES, 2-INPUT NAND GATE, PDSO5 | CON N3408-5002RB 3M 8X2 RA-DL1 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | - |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | - |
| 包装说明 | TSSOP, TSSOP5/6,.08 | TSOP, TSOP5/6,.11,37 | TSOP, TSOP5/6,.11,37 | - | TSSOP, TSSOP5/6,.08 | - |
| Reach Compliance Code | unknow | unknow | unknow | - | unknow | - |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | - | R-PDSO-G5 | - |
| JESD-609代码 | e3 | e3 | e3 | - | e3 | - |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | - | NAND GATE | - |
| 最大I(ol) | 0.008 A | 0.008 A | 0.008 A | - | 0.008 A | - |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 | - |
| 端子数量 | 5 | 5 | 5 | - | 5 | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - |
| 封装代码 | TSSOP | TSOP | TSOP | - | TSSOP | - |
| 封装等效代码 | TSSOP5/6,.08 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | - | TSSOP5/6,.08 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 电源 | 5 V | 2/5.5 V | 5 V | - | 2/5.5 V | - |
| Prop。Delay @ Nom-Su | 10 ns | 9.5 ns | 10 ns | - | 9.5 ns | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - |
| 施密特触发器 | NO | NO | NO | - | NO | - |
| 表面贴装 | YES | YES | YES | - | YES | - |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | - |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | - |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING | - |
| 端子节距 | 0.635 mm | 0.95 mm | 0.95 mm | - | 0.635 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved