Shift Register, 8-Bit, TTL, PDIP14
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
JESD-30 代码 | R-PDIP-T14 |
JESD-609代码 | e0 |
位数 | 8 |
功能数量 | 1 |
端子数量 | 14 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP14,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
N7491AN-B | S5491F/883C | S5491F/883B | N7491A | S5491W/883C | S5491W/883B | S5491W | |
---|---|---|---|---|---|---|---|
描述 | Shift Register, 8-Bit, TTL, PDIP14 | Shift Register, 8-Bit, TTL, CDIP14 | Shift Register, 8-Bit, TTL, CDIP14 | Shift Register, 8-Bit, TTL, PDIP14 | Shift Register, 8-Bit, TTL, CDFP14 | Shift Register, 8-Bit, TTL, CDFP14 | Shift Register, 8-Bit, TTL, CDFP14, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
JESD-30 代码 | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-XDFP-F14 | R-XDFP-F14 | R-XDFP-F14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 70 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | - | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DFP | DFP | DFP |
封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 | FL14,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK | FLATPACK |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | YES | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | FLAT |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | - | DFP, FL14,.3 | DFP, FL14,.3 | DFP, FL14,.3 |
最大频率@ Nom-Sup | - | 10000000 Hz | 10000000 Hz | 10000000 Hz | 10000000 Hz | 10000000 Hz | - |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | - | MIL-STD-883 Class C | MIL-STD-883 Class B (Modified) | - | MIL-STD-883 Class C | MIL-STD-883 Class B (Modified) | - |
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