BOARD/WIRE-TO-BOARD
CONNECTORS
MINITEK™ HEADERS FOR
PIN-IN-PASTE PROCESSES
Products for solder-to-board applications
OVERVIEW
Minitek is FCI’s brand for board-to-board and
wire/cable-to-board connectors in 2.00mm pitch.
The Minitek product range includes PCB Card Connectors,
Shrouded and Unshrouded headers and IDC/CTW receptacles.
FCI is adding five new series of Minitek Headers to its product
range, dedicated to Pin-in-Paste soldering processes. This
brochure gives additional information for the correct use of
Minitek PIP connectors in the application process.
MINITEK™ HEADERS FOR
PIN-IN-PASTE PROCESSES
PIN-IN-PASTE
Pin-in-Paste (PiP) technology allows the use of TMT products in SMT manufacturing processes. The connectors are
automatically or manually placed on the board, then soldered in the same operationas the SMT components. Despite this,
the mechanical strenght of the TMT soldering is maintained – still an important requirement for connectors nowadays in
many industrial or automotive applications.
CONNECTOR DESIGN
In order to achieve optimum soldering results, FCI launches dedicated Pin-in-Paste connectors in the basics+
product range. These connectors are fully adapted to Pin-in-Paste processing in all aspects, including plastic material,
housing design, pin length, and packaging.
PLASTIC MATERIAL
Minitek PIP headers are moulded in high temperature
thermoplastic and are able to withstand exposure to 260°C
peak temperature for 30 seconds maximum in a convection,
infra-red or vapour phase reflow oven.
HOUSING DESIGN
Standoffs raise the housing body slightly above the PCB
surface and thus allow the molten solder paste to flow freely
from its printed position into the board hole and around the
pin. The standoffs are correctly positioned for a good
solder paste deposit around the pin. Please respect the
stencil design guidelines below in order to avoid paste
deposit around the standoffs.
PIN LENGTH
The connector lead length beyond the bottom of the PCB is
shorter than for traditional TMT products. Thus, the risk of
pushing out the solder paste when inserting the pin into the
PCB hole is very much limited. The solder paste will not stick
on the pin tip or even fall off completely, but stays
around the pin for free flow during soldering. FCI uses a
solder tail length of 2 ± 0.2mm for Minitek Headers for a
standard PCB of 1.6mm thickness.
PACKAGING
For combining SMT and TMT components not only in the
soldering process, but also in the assembly process, FCI
proposes a choice of pick-and-place packaging for PIP
connectors. The most common part numbers are available
in tape-on-reel packaging, all others in tube.
For more information,
please contact: Communications@fci.com
or visit us at
www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
MINITEK™ HEADERS FOR
PIN-IN-PASTE PROCESSES
TECHNICAL INFORMATION
UNSHROUDED/STACKING
MATERIALS
• Housing: high temperature thermoplastic
• Colour: black
• Flammability rating: UL94V-O
• Pin: Phosphor bronze
• Plating: Gold and tin over 1.27µm nickel
MECHANICAL PERFORMANCE
• Pin retention: 7 N min.
SPECIFICATIONS
•
•
File no. E66906
File no. LR46923
• Product drawing: by 8-digit base part number
• Product specification: DPS-12-011 and GS-12-163
• Application specification: TA-895
• Reflow profile: TA-842
ELECTRICAL PERFORMANCE
• Current rating: 1A continuous
• Insulation resistance: 1000ΩM min.
• Dielectric withstanding voltage: 650V
ENVIRONMENTAL
• Operating temperature range: -55°C to +125°C
PROCESSING INFORMATION
• Compatible with IR reflow soldering processes
APPROVALS AND CERTIFICATIONS
• This product is RoHS compatible according to
the European Union Directive 2002/95/IEC
SHROUDED:
MATERIALS
• Housing: high temperature thermoplastic
• Colour: black
• Flammability rating: UL94V-O
• Pin: Phosphor bronze
• Plating: Gold and tin over 1.27µm nickel
MECHANICAL PERFORMANCE
• Pin retention: 7 N min.
SPECIFICATIONS
•
•
File no. E66906
File no. LR46923
• Product drawing: by 8-digit base part number
• Product specification: DPS-12-011 and GS-12-163
• Application specification: TA-896
• Reflow profile: TA-842
ELECTRICAL PERFORMANCE
• Current rating: 2A continuous
• Insulation resistance: 1000ΩM min.
• Dielectric withstanding voltage: 650V
ENVIRONMENTAL
• Operating temperature range: -40°C to +125°C
PROCESSING INFORMATION
• Compatible with IR reflow soldering processes
APPROVALS AND CERTIFICATIONS
• This product is RoHS compatible according to
the European Union Directive 2002/95/IEC
For more information,
please contact: Communications@fci.com
or visit us at
www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
MINITEK™ HEADERS FOR
PIN-IN-PASTE PROCESSES
APPLICATION DESIGN GUIDELINES
For application in a Pin-in-Paste process, FCI recommends
the application design guidelines below.
STENCIL DESIGN
The stencil design is crucial for a good solder joint.
It determines the quantity of paste and the position of the
paste print on the board. Each PCB hole has its own stencil
aperture with enough spacing in between in order to have
separate solder deposits.
This prevents solder robbing from one hole to another and
guarantees the correct quantity of solder paste for each hole.
The print position is slightly asymmetrical so as to optimise
the flow of molten solder paste.
PASTE APPLICATION
The quantity of paste for each hole depends on the
soldering process parameters and the degree of hole
filling. For the squeegee, FCI recommends a 45° angle.
You can use a smaller angle for an even greater degree of
hole filling. The squeegee moves in parallel with with the
shorter sides of the stencil apertures.
BOARD LAYOUT
Please use a hole of 0.8mm (right angle headers) or
0.85mm (vertical headers) ± 0.05mm for an optimum
paste deposit. For automatic pick-and-place, lean towards
the upper end of the tolerance.
Refer also to TA-895 (for Headers right angle Shrouded
and Unshrouded) et TA-896 (for Headers vertical
Shrouded and Unshrouded).
For more information,
please contact: Communications@fci.com
or visit us at
www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
MINITEK™ HEADERS FOR
PIN-IN-PASTE PROCESSES
PART NUMBER
8 - DIGIT BASE
PART NUMBER
PLATING
PIN
STYLE
NO. OF POSITIONS
PER ROW
PACKAGING
LF
Minitek Unshrouded Header
10075024
10072353
Vertical
Right Angle
G
Pin Style
01
02 to 25
U
A
Mating Side
mm
4.00
Solder Side
mm
2.00
Tube without cap from 04 to 25 pos
Tape availability on request
0.76µm (30µin.) Gold on contact
area, 2-6µm (50-150µin.)
Tin on solder side
Gold flash on mating area,
2-6µm (50-150µin.)
Tin on solder side
3 - DIGIT BASE
PART NUMBER
PLATING
F
PIN
STYLE
NO. OF POSITIONS
PER ROW
PACKAGING
STACK
HEIGHT
XXX = mm
LF
Minitek Unshrouded Header
02 to 25
59362
Vertical
G
U
T
Pin Style
22
24
26
28
30
32
34
36
38
40
Oal
08.2
09.6
10.2
11.8
13.5
14.1
15.6
17.1
19.1
21.1
Solder Side
mm
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
A
Specify mm (i.e., 037=03.7)
in 0.1 mm increments
0.76µm (30µin.) Gold on contact area,
0.76µm (30µin.) Gold on tail
0.76µm (30µin.) Gold on contact area,
2.54µm (0.100µin.) 100 % Matte tin
on tail
Tube without cap from 04 to 25 pos
Tape availability on request
For more information,
please contact: Communications@fci.com
or visit us at
www.fci.com
Disclaimer
Please note that the above information is subject to change without notice.
FPGA/CPLD
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