D Latch, 1-Func, 8-Bit, TTL, CDIP20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | D LATCH |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 54F573/BRA | 54F574/BRA | 54F574/BSA | 54F573/BSA | 54F574/B2A | 54F573/B2A | |
|---|---|---|---|---|---|---|
| 描述 | D Latch, 1-Func, 8-Bit, TTL, CDIP20 | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDIP20 | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDFP20 | D Latch, 1-Func, 8-Bit, TTL, CDFP20 | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CQCC20 | D Latch, 1-Func, 8-Bit, TTL, CQCC20 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-XDIP-T20 | R-XDIP-T20 | R-XDFP-F20 | R-XDFP-F20 | S-XQCC-N20 | S-XQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | D LATCH | D FLIP-FLOP | D FLIP-FLOP | D LATCH | D FLIP-FLOP | D LATCH |
| 功能数量 | 1 | 8 | 8 | 1 | 8 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DFP | DFP | QCCN | QCCN |
| 封装等效代码 | DIP20,.3 | DIP20,.3 | FL20,.3 | FL20,.3 | LCC20,.35SQ | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | FLATPACK | FLATPACK | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | NO LEAD | NO LEAD |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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