• Small Form Factor Multi-soured 2 x 5 Pin Package
• Complies with ITU-T/STM-4, OC-12
• 1310nm Wavelength, FP Laser
• Single +3.3V Power Supply
• LVPECL Differential Inputs and Outputs
• LVTTL Signal Detection Output (C-13-622C-F-SLC(A)-55-G5)
• LVPECL Signal Detection Output (C-13-622-F-SLC(A)-55-G5)
• Class 1 Laser International Safety Standard IEC 825 Compliant
• Solder ability to MIL-STD-883, Method 2003
• Pin coating is Sn/Pb with minimum 2% Pb content
• Flammability to UL94V0
• Humidity RH 5-85% (5-95% short term) to IEC 68-2-3
• Complies with Bell core GR-468-CORE
• Uncooled laser diode with MQW structure
• ATM 622 Mbps Links application
• SONET/SDH Equipment Interconnect application
• RoHS compliant
Absolute Maximum Rating
Parameter
Power Supply Voltage
Output Current
Soldering Temperature
Operating Temperature
Storage Temperature
Symbol
V
cc
I
out
-
Min.
0
0
-
0
-40
Max.
3.6
30
260
70
85
Unit
V
mA
ºC
ºC
ºC
Note
10 seconds on leads only
T
opr
T
stg
Recommended Operating Condition
Parameter
Power Supply Voltage
Operating Temperature (Case)
Operating Temperature (Case)
Data Rate
Symbol
V
cc
T
opr
T
opr
-
Min.
3.1
0
-40
-
Typ.
3.3
-
-
622
Max.
3.5
70
85
-
Unit
V
ºC
ºC
Mbps
C-13-622(C)-F-SLC(-55)-G5
C-13-622(C)-F-SLCA(-55)-G5
Note
Transmitter Specifications
Parameter
Optical
Optical Transmit Power
Output center Wavelength
Output Spectrum Width
Extinction Ratio
Output Eye
Optical Rise Time
Optical Fall Time
Relative Intensity Noise
Total Jitter
t
r
t
f
RIN
TJ
P
o
λ
p
∆λ
rms
ER
-15
1274
-
8.2
-
-
-
-
-
1310
-
-
-
-
-
-
-8
1356
2.5
-
1.2
1.2
-120
0.55
dBm
nm
nm
dB
ns
ns
dB/Hz
ns
Measured with 2
23
-1 PRBS with 72 ones
and 72 zeros.
10% to 90% Values
10% to 90% Values
RMS(σ)
Symbol
Min
Typical
Max
Unit
Notes
Compliant with ITU-T G.957/STM-4 Eye Mask
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
1
LUMNDS1932-Aug0508
Rev A.0
622 Mbps Single Mode SFF LC Transceiver
C-13-622(C)-F-SLC(A)(-55)-G5
Transmitter Specifications
Parameter
Electrical
Supply Current
Transmitter Enable Voltage
Transmitter Disable Voltage
Data Input Current-Low
Data Input Current-High
Data Input Voltage-Low
Data Input Voltage-High
I
CC
V
EN
V
D
I
IL
I
IH
V
IL
-V
CC
V
IH
-V
CC
-
0
2
-200
-
-2.0
-1.1
-
-
-
-
-
-
-
160
0.8
Vcc
-
200
-1.58
-0.74
mA
V
V
µA
µA
V
V
These inputs are compatible with 10K,
10KH and 100K ECL and PECL inputs
Maximum current is specified at Vcc=
Maximum @ maximum temperature
Symbol
Min
Typical
Max
Unit
Notes
Receiver Specifications
Parameter
Optical
Sensitivity
Maximum Input Power
Signal Detect-Asserted
Signal Detect-Deasserted
Signal Detect-Hysteresis
Wavelength of Operation
-
P
in
Pa
Pd
-
-3
-
-40
1
1100
-
-
-
-
-
-
-28
-
-28
-
5
1600
dBm
dBm
dBm
dBm
dB
nm
Measured on transition: low to high
Measured on transition: high to low
Measured with 2
23
-1 PRBS, BER=10
-10
Symbol
Min
Typical
Max
Unit
Notes
Receiver Specifications
Parameter
Electrical
Supply Current
Data Output Voltage-Low
Data Output Voltage-High
Signal Detect Output Voltge-Low
Signal Detect Output Voltage-High
I
CC
V
OL
-V
cc
V
OH
-
V
cc
V
SDL-
V
cc
V
SDH-
V
cc
-
-2.0
-1.1
-2.0
-1.1
-
-
-
-
-
120
-1.58
-0.74
-1.58
-0.74
mA
V
V
V
V
The current excludes the output load current
These outputs are compatible with 10K,
10KH and 100KECL and PECL outputs
Symbol
Min
Typical
Max
Unit
Note
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
2
LUMNDS1932-Aug0508
Rev A.0
622 Mbps Single Mode SFF LC Transceiver
C-13-622(C)-F-SLC(A)(-55)-G5
Connection Diagram
PIN
1
2
3
4
5
6
7
8
Warnings
9
10
Symbol
RxGND
RxVcc
SD
RD-
RD+
TxVcc
TxGND
TxDIS
TD+
TD-
Notes
Directly connect this pin to the receiver ground plane
+3.3V dc power for the receiver section
Active high on this indicates a received optical signal(LVPECL)
Receiver Data Out Bar (LVPECL)
Receiver Data Out (LVPECL)
+3.3V dc power for the trasmitter section
Directly connect this pin to the transmitter ground plane
Transmitter disable (LVTTL)
Transmitter Data In (LVPECL)
Transmitter Data In Bar (LVPECL)
The attaching posts are at case potential and may be connected to chassis
ground. They are isolated from circuit ground.
Attaching Posts
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
3
LUMNDS1932-Aug0508
Rev A.0
622 Mbps Single Mode SFF LC Transceiver
C-13-622(C)-F-SLC(A)(-55)-G5
Recommended Circuit Schematic
PHY DEVICE
TERMINATE AT
TRANSCEIVER INPUTS
Vcc(+3.3V)
Z=50
TD-
100
LVPECL
Z=50
130
1
H
TD+
10
TD-
9
TD+
8
TxDIS
7
TxGND
6
TxVcc
C2
Vcc(+3.3V)
C3
Tx
Rx
10
F
RxGND
RxVcc
RD+
RD-
SD
1
H
C1
Vcc(+3.3V)
RD+
1
2
3
4
5
Z=50
100
RD-
LVPECL
Z=50
130
130
Z=50
Vcc(+3.3V)
130
SD
82
NOTE:C1=C2=C3=100nF
TERMINATE AT
DEVICE INPUTS
The split-loaded terminations for ECL signals need to be located at the input of devices receiving those ECL signals.
The power supply filtering is required for good EMI performance. Use short tracks from the inductor L1/L2 to the module Rx Vcc.
A GND plane under the module is required for good EMI and sensitivity performance.
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
4
LUMNDS1932-Aug0508
Rev A.0
622 Mbps Single Mode SFF LC Transceiver
C-13-622(C)-F-SLC(A)(-55)-G5
Printed Circuit Board Layout Consideration
A fiber-optic receiver employs a very high gain, wide bandwidth transimpedance amplifier. This amplifier detects and amplifies signals
that are only tens of nA in amplitude when the receiver is operating near it’s limit. Any unwanted signal current that couples into the receiver
circuitry causes a decrease in the receiver’s sensitivity and can also degrade the performance of the receiver’s signal detect (SD) circuit. To minimize
the coupling of unwanted noise into the receiver, careful attention must be given to the printed circuit board.
At a minimum, a double-sided printed circuit board(PCB) with a large component side ground plane beneath the transceiver must be
used. In applications that include many other high speed devices, a multi-layer PCB is highly recommended. This permits the placement of power
and ground on separate layers, wich allows them to be isolated from the signal lines. Multilayer construction also permits the routing of signal
traces away from high level, high speed sinal lines. To minimize the possibility of coupling noise into the receiver section, high level, high speed
signals such as transmitter inputs and clock lines should be routed as far away as possible from the receiver pins.
Noise that couples into the receiver through the power supply pins can also degrade performance. It is recommended that a pi filter be
used in both transmitter and receiver power supplies.
EMI and ESC Consideration
OIC transceivers offer a metalized plastic case and a special chassis grounding clip. As shown in the drawing, this clip connects the
module case to chassis ground then installs flush through the panel cutout. This way, the grounding clip brushes the edge of the cutout in order
to make a proper contact. The use of a grounding clip also provides increased electrostatic protection and helps reduce radiated emission from the
module or the host circuit board through the chassis faceplate. The attaching posts are at case potential and may be connected to chassis ground.
They should not be connected to circuit ground.
Plastic optical subassemblies are used to further reduce the possibility of radiated emission by eliminating the metal from the
transmitter and receiver diode housings, which extend into connector space. By providing a non-metal receptacle for the optical cable ferrule, the
gigabit speed RF electrical signal is isolated from the connector area thus preventing radiated energy leakage from these surfaces to the outside of
the panel.
Recommended Board Layout Hole Pattern
DIMENSION IN MILLIMETER (INCHES)
NOTES:
1.THIS FIGURE DESCRIBE THE RECOMMAND CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2.THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFF. NO METAL
TRACES OR GROUND CONNECTION IN KEEP-OUT AREAS.
3.THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY.
LUMINENTOIC.COM
20550 Nordhoff St. • Chatsworth, CA 91311 • tel: 818.773.9044 • fax: 818.576.9486
9F, No 81, Shui Lee Rd. • Hsinchu, Taiwan, R.O.C. • tel: 886.3.5169222 • fax: 886.3.5169213
射频识别(Radio Frequency Identification，RFID)技术是一种利用无线射频通信实现的非接触式自动识别技术，与目前广泛采用的条形码技术相比，RFID具有容量大、识别距离远、穿透能力强、抗污性强等特点。RFID技术已经发展得比较成熟并获得了大规模商用，但超高频RFID技术相对滞后。本文分析了射频芯片nRF9E5的功能特性，并将其用于RFID系统中，设计了一套有源超高频(...[详细]
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