REVISIONS
LTR
DESCRIPTION
DATE
(YR-MO-DA)
APPROVED
REV
SHEET
REV
SHEET
15
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REV STATUS
OF SHEETS
PMIC N/A
STANDARDIZED
MILITARY
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
REV
SHEET
PREPARED BY
1
2
3
4
5
6
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9
10
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Jeffery D. Bowling
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
CHECKED BY
Ray Monnin
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, 8K X 9 DUAL PORT FIFO,
MONOLITHIC SILICON
SIZE
CAGE CODE
92-09-25
AMSC N/A
REVISION LEVEL
A
SHEET
1
67268
OF
27
5962-91677
DESC FORM 193
JUL 91
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E380
1. SCOPE
1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two
product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device
classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying
Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of
MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a
choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
91677
01
M
X
X
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. Device classes M, B, and S RHA marked devices shall meet the
MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA
marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A
dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
03
Generic number 1/
Circuit function
Access time
80 ns
50 ns
30 ns
8K x 9 dual port CMOS FIFO
8K x 9 dual port CMOS FIFO
8K x 9 dual port CMOS FIFO
1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level
as follows:
Device class
M
B or S
Q or V
Device requirements documentation
Vendor self-certification to the requirements for non-JAN class B
microcircuits in accordance with 1.2.1 of MIL-STD-883
Certification and qualification to MIL-M-38510
Certification and qualification to MIL-I-38535
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
Descriptive designator
GDIP1-T28 or CDIP2-T28
CDIP3-T28 or GDIP4-T28
CQCC1-N32
Terminals
28
28
32
Package style
Dual-in-line
Dual-in-line
Rectangular leadless chip carrier
1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes
Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in
specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
1/
Generic numbers are listed on the Standarized Military Drawing Source Approval Bulletin at the end of this document and
will also be listed in MIL-BUL-103.
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
SIZE
A
REVISION LEVEL
5962-91677
SHEET
2
1.3 Absolute maximum ratings. 2/
Supply voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation (P
D
) . . . . . . . . . . . . . . . . . . .
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . .
Thermal resistance, junction-to-case (
JC
):
Cases X, Y, and Z . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Junction temperature (T
J
) . . . . . . . . . . . . . . . . . . . . . . . .
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) . . . . . . . . .
Minimum high level input voltage (V
IH
) .
Maximum low level input voltage (V
IL
) .
Case operating temperature range (T
C
)
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4.5 V dc to 5.5 V dc
2.2 V dc 4/
0.8 V dc 5/
-55
C to +125
C
-0.5 V dc to +7.0 V dc
50 mA
-65
C to +150
C
2.0 W
+260
C
See MIL-STD-1835
+150
C 3/
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) . . . . . .
2. APPLICABLE DOCUMENTS
2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications,
standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and
Standards specified in the solicitation, form a part of this drawing to the extent specified herein.
SPECIFICATIONS
MILITARY
MIL-M-38510
MIL-I-38535
STANDARDS
MILITARY
MIL-STD-480
MIL-STD-883
MIL-STD-1835
BULLETIN
MILITARY
MIL-BUL-103
-
List of Standardized Military Drawings (SMD's).
-
-
-
Configuration Control-Engineering Changes, Deviations and Waivers.
Test Methods and Procedures for Microelectronics.
Microcircuit Case Outlines.
-
-
Microcircuits, General Specification for.
Integrated Circuits, Manufacturing, General Specification for.
XX percent 6/
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/ Maximum junction temperature may be increased to +175
C during burn-in and steady-state life.
4/ For XI input, V
IH
= 2.8 V dc .
5/ 1.5 V dc undershoots are allowed for 10 ns once per cycle.
6/ Values will be added when they become available.
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
SIZE
A
REVISION LEVEL
5962-91677
SHEET
3
HANDBOOK
MILITARY
MIL-HDBK-780
-
Standardized Military Drawings.
(Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific
acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.)
2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS
cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the
documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-88 - Standard Guide for the Measurement of Single Event Phenomena from Heavy Ion
Irradiation
of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials, 1916
Race Street, Philadelphia, PA 19103).
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard No. 17 - A Standardized Test Procedure for the Characterization of Latch-up in CMOS Integrated
Circuits.
(Applications for copies should be addressed to the Electronics Industries Association, 2001 Eye Street, N.W., Washington,
DC 20006.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute
the documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing shall take precedence.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device class M shall be in accordance with 1.2.1 of
MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein.
The individual item requirements for device classes B and S shall be in accordance with MIL-M-38510 and as specified herein.
For device classes B and S, a full electrical characterization table for each device type shall be included in this SMD. The
individual item requirements for device classes Q and V shall be in accordance with MIL-I-38535, the device manufacturer's
Quality Management (QM) plan, and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-M-38510 for device classes M, B, and S and MIL-I-38535 for device classes Q and V and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth tables. The truth tables shall be as specified on figure 2.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the
full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The
electrical tests for each subgroup are defined in table I.
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
SIZE
A
REVISION LEVEL
5962-91677
SHEET
4
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance
with MIL-STD-883 (see 3.1 herein). In addition, the manufacturer's PIN may also be marked as listed in MIL-BUL-103.
Marking for device classes B and S shall be in accordance with MIL-M-38510. Marking for device classes Q and V shall be in
accordance with MIL-I-38535.
3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a "C" as required in MIL-STD-883
(see 3.1 herein). The certification mark for device classes B and S shall be a "J" or "JAN" as required in MIL-M-38510. The
certification mark for device classes Q and V shall be a "QML" as required in MIL-I-38535.
3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in
order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). For device classes Q and V, a
certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this
drawing (see 6.7.2 herein). The certificate of compliance submitted to DESC-ECS prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device class M the requirements of
MIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements of MIL-I-38535 and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1
herein) or device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-I-38535 shall be provided with each lot
of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DESC-ECS of change of product (see 6.2
herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-480.
3.9 Verification and review for device class M. For device class M, DESC, DESC's agent, and the acquiring activity retain
the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made
available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device classes M, B, and S. Device classes M, B, and S devices covered by this
drawing shall be in microcircuit group number 105 (see MIL-M-38510, appendix E).
3.11 Serialization for device class S. All device class S devices shall be serialized in accordance with MIL-M-38510.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device class M, sampling and inspection procedures shall be in accordance with section
4 of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). For device classes B and S, sampling and
inspection procedures shall be in accordance with MIL-M-38510 and method 5005 of MIL-STD-883, except as modified herein.
For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-I-38535 and the device
manufacturer's QM plan.
4.2 Screening. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be
conducted on all devices prior to quality conformance inspection. For device classes B and S, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to qualification and quality
conformance inspection. For device classes Q and V, screening shall be in accordance with MIL-I-38535, and shall be
conducted on all devices prior to qualification and technology conformance inspection.
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
SIZE
A
REVISION LEVEL
5962-91677
SHEET
5
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