RISC Microprocessor, 32-Bit, 10MHz, MOS, CDIP64
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Motorola ( NXP ) |
| 包装说明 | DIP, DIP64,.9 |
| Reach Compliance Code | unknown |
| 位大小 | 32 |
| JESD-30 代码 | R-XDIP-T64 |
| JESD-609代码 | e0 |
| 端子数量 | 64 |
| 最高工作温度 | 110 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP64,.9 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 速度 | 10 MHz |
| 最大压摆率 | 333 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | MOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
| Base Number Matches | 1 |
| 68000-10/BXAJC | 56001-20/BYCJC | 68000-12/BYCJC | 68000-8/BUAJC | 68442/BZAJC | 68HC000-10/BUAJC | 68HC000-12/BUAJC | |
|---|---|---|---|---|---|---|---|
| 描述 | RISC Microprocessor, 32-Bit, 10MHz, MOS, CDIP64 | Digital Signal Processor, 24-Bit Size, CMOS, CQFP100 | Microprocessor | RISC Microprocessor, 32-Bit, 8MHz, MOS, CQCC68 | Micro Peripheral IC | RISC Microprocessor, 32-Bit, 10MHz, CMOS, CQCC68 | RISC Microprocessor, 32-Bit, 12.5MHz, CMOS, CQCC68 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | Motorola ( NXP ) | - | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
| 包装说明 | DIP, DIP64,.9 | QFP, QFP100,1.1SQ | - | QCCN, LCC68,.95SQ | - | QCCN, LCC68,.95SQ | QCCN, LCC68,.95SQ |
| 位大小 | 32 | 24 | - | 32 | - | 32 | 32 |
| JESD-30 代码 | R-XDIP-T64 | S-XQFP-G100 | - | S-XQCC-N68 | - | S-XQCC-N68 | S-XQCC-N68 |
| JESD-609代码 | e0 | e0 | - | e0 | - | e0 | e0 |
| 端子数量 | 64 | 100 | - | 68 | - | 68 | 68 |
| 最高工作温度 | 110 °C | 125 °C | - | 110 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C | - | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | - | CERAMIC | - | CERAMIC | CERAMIC |
| 封装代码 | DIP | QFP | - | QCCN | - | QCCN | QCCN |
| 封装等效代码 | DIP64,.9 | QFP100,1.1SQ | - | LCC68,.95SQ | - | LCC68,.95SQ | LCC68,.95SQ |
| 封装形状 | RECTANGULAR | SQUARE | - | SQUARE | - | SQUARE | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | - | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5 V | 5 V | - | 5 V | - | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 速度 | 10 MHz | - | - | 8 MHz | - | 10 MHz | 12.5 MHz |
| 标称供电电压 | 5 V | 5 V | - | 5 V | - | 5 V | 5 V |
| 表面贴装 | NO | YES | - | YES | - | YES | YES |
| 技术 | MOS | CMOS | - | MOS | - | CMOS | CMOS |
| 温度等级 | OTHER | MILITARY | - | OTHER | - | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | - | NO LEAD | - | NO LEAD | NO LEAD |
| 端子节距 | 2.54 mm | 0.635 mm | - | 1.27 mm | - | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | - | QUAD | - | QUAD | QUAD |
| uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | - | - | MICROPROCESSOR, RISC | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - |
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