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74VHC32BQ: 产品描述AHC/VHC/H/U/V SERIES, QUAD 2-INPUT OR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14; 产品类别逻辑逻辑; 文件大小76KB，共14页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

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74VHC32BQ概述

AHC/VHC/H/U/V SERIES, QUAD 2-INPUT OR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14

74VHC32BQ规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	QFN
包装说明	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
针数	14
Reach Compliance Code	unknown
系列	AHC/VHC/H/U/V
JESD-30 代码	R-PQCC-N14
JESD-609代码	e4
长度	3 mm
逻辑集成电路类型	OR GATE
湿度敏感等级	1
功能数量	4
输入次数	2
端子数量	14
最高工作温度	125 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	HVQCCN
封装形状	RECTANGULAR
封装形式	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）	260
传播延迟（tpd）	14.5 ns
认证状态	Not Qualified
座面最大高度	1 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	2 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	NICKEL PALLADIUM GOLD
端子形式	NO LEAD
端子节距	0.5 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	30
宽度	2 mm

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74VHC32; 74VHCT32

Quad 2-input OR gate

Rev. 01 — 13 August 2009

Product data sheet

1. General description

The 74VHC32; 74VHCT32 are high-speed Si-gate CMOS devices and are pin compatible

with Low-power Schottky TTL (LSTTL). They are speciﬁed in compliance with JEDEC

standard No. 7-A.

The 74VHC32; 74VHCT32 provide the 2-input OR function.

2. Features

Balanced propagation delays

All inputs have Schmitt-trigger actions

Inputs accept voltages higher than V

Input levels:

The 74VHC32 operates with CMOS input level

The 74VHCT32 operates with TTL input level

ESD protection:

HBM JESD22-A114E exceeds 2000 V

MM JESD22-A115-A exceeds 200 V

CDM JESD22-C101C exceeds 1000 V

Multiple package options

Speciﬁed from

−40 °C

to +85

°C

and from

−40 °C

to +125

°C

3. Ordering information

Table 1.

Ordering information

Package

Temperature range Name

74VHC32D

74VHCT32D

74VHC32PW

74VHCT32PW

74VHC32BQ

74VHCT32BQ

−40 °C

to +125

°C

DHVQFN14

−40 °C

to +125

°C

TSSOP14

−40 °C

to +125

°C

SO14

Description

plastic small outline package; 14 leads;

body width 3.9 mm

plastic thin shrink small outline package; 14 leads;

body width 4.4 mm

Version

SOT108-1

SOT402-1

Type number

plastic dual in-line compatible thermal enhanced very SOT762-1

thin quad ﬂat package; no leads; 14 terminals;

body 2.5

0.85 mm

74VHC32BQ相似产品对比

	74VHC32BQ	74VHC32D	74VHC32PW	74VHCT32PW	74VHCT32D	74VHCT32BQ
描述	AHC/VHC/H/U/V SERIES, QUAD 2-INPUT OR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14	AHC/VHC/H/U/V SERIES, QUAD 2-INPUT OR GATE, PDSO14, 3.90 MM , PLASTIC, MS-012, SOT108-1, SOP-14	AHC/VHC/H/U/V SERIES, QUAD 2-INPUT OR GATE, PDSO14, 4.40 MM , PLASTIC, MO-153, SOT402-1, TSSOP-14	AHCT/VHCT/VT SERIES, QUAD 2-INPUT OR GATE, PDSO14, 4.40 MM , PLASTIC, MO-153, SOT402-1, TSSOP-14	AHCT/VHCT/VT SERIES, QUAD 2-INPUT OR GATE, PDSO14, 3.90 MM , PLASTIC, MS-012, SOT108-1, SOP-14	AHCT/VHCT/VT SERIES, QUAD 2-INPUT OR GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
是否Rohs认证	符合	符合	符合	符合	符合	符合
零件包装代码	QFN	SOIC	TSSOP	TSSOP	SOIC	QFN
包装说明	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14	3.90 MM , PLASTIC, MS-012, SOT108-1, SOP-14	4.40 MM , PLASTIC, MO-153, SOT402-1, TSSOP-14	4.40 MM , PLASTIC, MO-153, SOT402-1, TSSOP-14	3.90 MM , PLASTIC, MS-012, SOT108-1, SOP-14	2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14
针数	14	14	14	14	14	14
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
系列	AHC/VHC/H/U/V	AHC/VHC/H/U/V	AHC/VHC/H/U/V	AHCT/VHCT/VT	AHCT/VHCT/VT	AHCT/VHCT/VT
JESD-30 代码	R-PQCC-N14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PQCC-N14
长度	3 mm	8.65 mm	5 mm	5 mm	8.65 mm	3 mm
逻辑集成电路类型	OR GATE	OR GATE	OR GATE	OR GATE	OR GATE	OR GATE
湿度敏感等级	1	1	1	1	1	1
功能数量	4	4	4	4	4	4
输入次数	2	2	2	2	2	2
端子数量	14	14	14	14	14	14
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	HVQCCN	SOP	TSSOP	TSSOP	SOP	HVQCCN
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）	260	260	260	260	260	260
传播延迟（tpd）	14.5 ns	14.5 ns	14.5 ns	10 ns	10 ns	10 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1 mm	1.75 mm	1.1 mm	1.1 mm	1.75 mm	1 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	2 V	2 V	2 V	2 V	2 V	2 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
端子形式	NO LEAD	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD
端子节距	0.5 mm	1.27 mm	0.65 mm	0.65 mm	1.27 mm	0.5 mm
端子位置	QUAD	DUAL	DUAL	DUAL	DUAL	QUAD
处于峰值回流温度下的最长时间	30	30	30	30	30	30
宽度	2 mm	3.9 mm	4.4 mm	4.4 mm	3.9 mm	2 mm

74VHC32BQ

74VHC32BQ概述

74VHC32BQ规格参数

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