电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

40T35-100C

产品描述RF/Microwave Termination, 0MHz Min, 50000MHz Max, 35ohm
产品类别无线/射频/通信    射频和微波   
文件大小128KB,共2页
制造商Cobham Semiconductor Solutions
下载文档 详细参数 全文预览

40T35-100C概述

RF/Microwave Termination, 0MHz Min, 50000MHz Max, 35ohm

40T35-100C规格参数

参数名称属性值
厂商名称Cobham Semiconductor Solutions
Reach Compliance Codeunknown
特性阻抗35 Ω
构造COMPONENT
最大工作频率50000 MHz
最小工作频率
射频/微波设备类型RF/MICROWAVE TERMINATION
Base Number Matches1

文档预览

下载PDF文档
Broadband Product Line
High Power Terminations Short Form
ADVANCED DATA SHEET
Model 10T Series
DC to 20 GHz
The 10T Series are High Power Thin-Film Terminations designed for use in 10 Gbit systems. An integrated DC
Block can be added to the termination for a reduction in DC current consumption and heat dissipation
10Gbit High Power Terminations
Aeroflex Part #
10T50-(100/500) (C/M )
10T40-(100/500) (C/M)
10T35-(100/500) (C/M)
DC
Termination
Value
50 ohms ±2%
40 ohms ±2%
35 ohms ±2%
Power
Handling
mW Min
100 / 500
100 / 500
100 / 500
Transmission
Line
CPWG / MS
CPWG / MS
CPWG / MS
S11, 0 - 20 GHz
-15 dB min
(with no wire-bonds)
-15 dB min
(with no wire-bonds, in 40W system)
-15 dB min
(with no wire-bonds, in 35W system)
Size
.138” x .079”
138” x .079“
138” x .079”
Notes:
1. These devices will need to be mounted on a heat sink with a good thermal / electrical conductive epoxy or solder.
2. Electrical connections are made through wire-bonds.
3. 100 = 100 mW, 500 = 500 mW, C = CPWG, M = Microstrip.
Model 40T Series
DC to 50 GHz
The 40T Series are High Power Thin-Film Terminations designed for use in 40 Gbit systems. An integrated DC
Block can be added to the termination for a reduction in DC current consumption and heat dissipation
40Gbit High Power Terminations
Aeroflex Part #
40T50-(100/500) (C/M)
40T40-(100/500) (C/M)
40T35-(100/500) (C/M)
DC
Termination
Value
50 ohms ±2%
40 ohms ±2%
35 ohms ±2%
Power
Handling
mW Min
100 / 500
100 / 500
100 / 500
Transmission
Line
CPWG / MS
CPWG / MS
CPWG / MS
S11, 0 - 20 GHz
-15 dB min
(with no wire-bonds)
-15 dB min
(with no wire-bonds, in 40W system)
-15 dB min
(with no wire-bonds, in 35W system)
Size
.138” x .079”
138” x .079“
138” x .079”
Notes:
1. These devices will need to be mounted on a heat sink with a good thermal / electrical conductive epoxy or solder.
2. Electrical connections are made through wire-bonds.
3. 100 = 100 mW, 500 = 500 mW, C = CPWG, M = Microstrip.

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1374  1361  775  1440  797  28  16  29  17  23 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved