REVISIONS
LTR
C
DESCRIPTION
Change to military drawing format. Table I, change V
RB
specification. Editorial
changes throughout.
Change on absolute maximum rating for operating temperature range.
Delete 4.3.1c. Change code identification number to 67268.
Remove subgroups 5 and 6 from table II.
Add vendor CAGE 34333 to device types 01, 05, and 11. Add vendor CAGE
15818 to device type 01. Delete vendor 27014 for device types 01, 02, 03, 04,
05, 10, 11, 12, and 13. Editorial changes throughout. Device types 02, 03, 04,
and 10 inactive for new design.
Drawing updated to reflect current requirements. Replaced reference to
MIL-STD-973 with reference to MIL-PRF-38535. -rrp
DATE (YR-MO-DA)
87-05-04
APPROVED
M. A. FRYE
D
87-09-17
M. A. FRYE
E
88-09-26
M. A. FRYE
F
03-12-16
R. MONNIN
CURRENT CAGE CODE 67268
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
F
1
F
2
F
3
F
4
F
5
F
6
F
7
F
8
F
9
PREPARED BY
MARCIA B. KELLEHER
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
D. H. JOHNSON
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
MICROCIRCUIT, LINEAR, VOLTAGE
REFERENCE, MONOLITHIC SILICON
DRAWING APPROVAL DATE
77-09-16
AMSC N/A
REVISION LEVEL
F
SIZE
A
SHEET
CAGE CODE
14933
1 OF
9
77028
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E081-04
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
77028
01
X
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
Generic number
LM103H-1.8
LM103H-2.0
LM103H-2.2
LM103H-2.4
LM103H-2.7
LM103H-3.0
LM103H-3.3
LM103H-3.6
LM103H-3.9
LM103H-4.3
LM103H-4.7
LM103H-5.1
LM103H-5.6
Circuit function
Voltage reference
Voltage reference
Voltage reference
Voltage reference
Voltage reference
Voltage reference
Voltage reference
Voltage reference
Voltage reference
Voltage reference
Voltage reference
Voltage reference
Voltage reference
V
B
at I
R
= 1 mA
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
See figure 1
Terminals
2
Package style
Modified can (TO-46)
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Power dissipation (P
D
) 1/ ......................................................
Reverse current (I
R
)................................................................
Forward curent (I
F
) .................................................................
Storage temperature range ....................................................
Lead temperature (60 seconds) .............................................
Junction temperature (T
J
).......................................................
1.4 Recommended operating conditions.
Ambient operating temperature range (T
A
) ............................ -55°C to +125°C
250 mW
20 mA
100 mA
-65°C to +150°C
+300°C
+150°C/W
1/
Operation at elevated temperature requires device derating based on +150°C maximum junction temperature, thermal
resistance of 80°C/W junction to case or +440°C/W junction to ambient.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
77028
SHEET
F
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed
in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in
the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 -- Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -- List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 and figure 1 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the
option of not marking the "5962-" on the device.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
77028
SHEET
F
3
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
400
µA ≤
I
R
≤
3.0 mA,
T
A
= +25°C
Test
Symbol
Group A
subgroups
1
Device
type
01
02
03
04
05
06
07
08
09
10
11
12
13
Limits
Min
1.62
1.80
1.98
2.16
2.43
2.70
2.97
3.24
3.51
3.87
4.23
4.59
5.04
Max
1.98
2.20
2.42
2.64
2.97
3.30
3.63
3.96
4.29
4.73
5.17
5.61
6.16
120
200
50
70
60
150
200
Unit
Reference breakdown
voltage
V
B
V
Reference breakdown
voltage change
∆V
B
/
∆I
R
10
µA ≤
I
R
≤
100
µA
100
µA ≤
I
R
≤
1 mA
1
2,3
1
2
3
All
mV
1 mA
≤
I
R
≤
5 mA
Reverse breakdown 2/
voltage temperature
coefficient
Reverse leakage current
Forward voltage drop
Reverse dynamic 3/
resistance
∆V
B
/
∆t
I
L
V
F
R
R
V
R
= V
B
- 0.2 V
I
F
= 5 mA
I
R1
= 3.15 mA,
I
R2
= 2.85 mA,
T
A
= +25°C
100
µA ≤
I
R
≤
1 mA
1
2,3
1,2,3
All
-8.0
mV/°C
1
2,3
1
2,3
4
All
All
All
-0.7
-0.05
5.0
50
-1.0
-1.5
25
µA
V
Ω
1/ Unless otherwise stated, -55°C
≤
T
A
≤
+125°C. The doide should not be operated with shunt capacitance between
100 pF and 0.01
µF
unless isolated by at least 270
Ω
resistor or oscillation may occur.
2/ If not tested shall be guaranteed to specified limits herein.
3/ Reverse dynamic resistance (R
R
) is defined as (V
B1
- V
B2
) / (I
R1
- I
R2
) where V
B1
is voltage across the device under
test when reverse current is equal to I
R1
and V
B2
is voltage across the device under test when reverse current is equal
to I
R2
.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
77028
SHEET
F
4
Case X
Symbol
A
φb
1
φD
φD
1
φe
e
1
F
k
k
1
L
α
Min
.080
.012
.209
.178
Inches
Max
.105
.019
.230
.195
.100 BSC
.050 BSC
----
.036
.028
.500
45° BSC
.040
.046
.048
.750
----
0.91
0.71
12.70
Min
2.03
0.30
5.31
4.52
Millimeters
Max
2.67
0.48
5.84
4.95
2.54 BSC
1.27 BSC
1.02
1.17
1.22
19.05
45° BSC
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
FIGURE 1. Case outline.
SIZE
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
A
REVISION LEVEL
77028
SHEET
F
5
测试/测量
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
