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73K224L-IP

产品描述V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem
产品类别无线/射频/通信    电信电路   
文件大小209KB,共32页
制造商TDK(株式会社)
官网地址http://www.tdk.com
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73K224L-IP概述

V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem

73K224L-IP规格参数

参数名称属性值
厂商名称TDK(株式会社)
零件包装代码DIP
包装说明DIP, DIP28,.6
针数28
Reach Compliance Codeunknown
其他特性FULL DUPLEX
数据速率2.4 Mbps
JESD-30 代码R-PDIP-T28
长度35.941 mm
功能数量1
端子数量28
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP28,.6
封装形状RECTANGULAR
封装形式IN-LINE
电源5 V
认证状态Not Qualified
座面最大高度5.588 mm
最大压摆率25 mA
标称供电电压5 V
表面贴装NO
技术CMOS
电信集成电路类型MODEM
温度等级INDUSTRIAL
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度15.24 mm

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73K224L
V.22bis/V.22/V.21/ Bell 212A/Bell 103
Single-Chip Modem
April 2000
DESCRIPTION
The 73K224L is a highly integrated single-chip
modem IC which provides the functions needed to
construct a V.22bis compatible modem, capable of
2400 bit/s full-duplex operation over dial-up lines. The
73K224L offers excellent performance and a high
level of functional integration in a single 28-pin DIP
and 44-pin TQFP package. This device supports
V.22bis, V.22, V.21, Bell 212A and Bell 103 modes of
operation,
allowing
both
synchronous
and
asynchronous communication. The 73K224L is
designed to appear to the systems designer as a
microprocessor peripheral, and will easily interface
with popular single-chip microprocessors (80C51
typical) for control of modem functions through its 8-
bit multiplexed address/data bus or via an optional
serial control bus. An ALE control line simplifies
address demultiplexing.
Data
communications
normally occur through a separate serial port. The
73K224L is pin and software compatible with the
73K212L and 73K222L single-chip modem ICs,
allowing system upgrades with a single component
change.
The 73K224L operates from a single +5V supply for
low power consumption.
The 73K224L is ideal for use in either free-standing or
integral system modem products where full-duplex
(continued)
FEATURES
One-chip multi-mode V.22bis/V.22/V.21 and Bell
212A/103 compatible modem data pump
FSK (300 bit/s), DPSK (600, 1200 bit/s), or QAM
(2400 bit/s) encoding
Pin and software compatible with other TDK
Semiconductor
Corporation
K-Series
1-chip
modems
Interfaces directly with standard microcontrollers
(80C51 typical)
Parallel microcontroller bus for modem control and
status monitoring functions
Selectable
asynch/synch
with
internal
buffer/debuffer
and
scrambler/descrambler
functions
All synchronous and asynchronous operating
modes (internal, external, slave)
Adaptive equalization for optimum performance
over all lines
Programmable transmit attenuation (16 dB, 1 dB
steps), selectable receive boost (+18 dB)
Call progress, carrier, answer tone, unscrambled
mark, S1, and signal quality monitors
DTMF, answer and guard tone generators
Test modes available: ALB, DL, RDL, Mark, Space,
Alternating bit, S1 pattern
CMOS technology for low power consumption
(typically 100 mW @ 5V) with power-down mode
(15 mW @ 5V)
TTL and CMOS compatible inputs and outputs
BLOCK DIAGRAM

73K224L-IP相似产品对比

73K224L-IP 73K224L 73K224L-IGT 73K224L-28IH 73K224L-IH
描述 V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem V.22bis/V.22/V.21/ Bell 212A/Bell 103 Single-Chip Modem
厂商名称 TDK(株式会社) - TDK(株式会社) - TDK(株式会社)
零件包装代码 DIP - QFP QLCC QLCC
包装说明 DIP, DIP28,.6 - LQFP, QCCJ, QCCJ, LDCC28,.5SQ
针数 28 - 44 28 28
Reach Compliance Code unknown - unknown unknow unknown
其他特性 FULL DUPLEX - DATA RATE MIN:300BPS FULL DUPLEX DATA RATE MIN:300BPS
数据速率 2.4 Mbps - 2.4 Mbps 2.4 Mbps 2.4 Mbps
JESD-30 代码 R-PDIP-T28 - S-PQFP-G44 S-PQCC-J28 S-PQCC-J28
长度 35.941 mm - 14 mm 11.5062 mm 11.5062 mm
功能数量 1 - 1 1 1
端子数量 28 - 44 28 28
最高工作温度 85 °C - 85 °C 85 °C 85 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP - LQFP QCCJ QCCJ
封装形状 RECTANGULAR - SQUARE SQUARE SQUARE
封装形式 IN-LINE - FLATPACK, LOW PROFILE CHIP CARRIER CHIP CARRIER
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified
座面最大高度 5.588 mm - 1.45 mm 4.572 mm 4.572 mm
最大压摆率 25 mA - - 25 mA 0.025 mA
标称供电电压 5 V - 5 V 5 V 5 V
表面贴装 NO - YES YES YES
技术 CMOS - CMOS CMOS CMOS
电信集成电路类型 MODEM - MODEM MODEM MODEM
温度等级 INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 THROUGH-HOLE - GULL WING J BEND J BEND
端子节距 2.54 mm - 1 mm 1.27 mm 1.27 mm
端子位置 DUAL - QUAD QUAD QUAD
宽度 15.24 mm - 14 mm 11.5062 mm 11.5062 mm
Base Number Matches - - 1 1 1

 
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