DPS-081104
CHIP BEADS ARRAY
Array Series
v
Features
•
Good reliability (Monolithic structure)
•
Magnetically shielded
•
Fast mounting speed
•
RoHS compliant
W
D
L
Size
L
W
3216
3.2±0.20
1.6±0.20
0.9±0.20
0.3±0.20
0.4±0.15
0.8±0.10
v
Dimensions
(unit : mm)
B
T
E
v
Applications
•
CD-ROM, DVD, MD Lines
•
Digital TVs and VTRs
v
General Code
CBA
1
T
B
3216
2
G
3
A
4
121
5
N4
6
E
7
E
D
1
2
3
4
5
6
7
Series Code
CBA : Chip Ferrite Beads Array
Dimension Code
The first two digits : length (mm)
The last two digits : width (mm)
Application Code
G : Signal Line
P : High Current Line
U : Ultra High Current Line
Material Code
A: General Frequency
K,J: Medium Frequency
M: High Frequency
V: Very High Frequency
Impedance Value Code
The first two digits represents significant
The last digit is the number of zeros following
ex) 121 = 120 (Ω)
Number of circuit
N4 : 4 array
Packaging Code
E : Reel embossed tape packaging
v
Temperature Range
•
Operating Temp. -55 ~ +125℃
•
Storage Temp. -10 ~ +40
℃
v
Typical Material Characteristics
High
μ
(Low RXCP)
Low
μ
(High RXCP)
V
M
J,K
A
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
v
3216 SIZE
Impedance
(Ω)
±25%
30
60
120
220
300
470
601
100
60
120
220
300
470
600
1000
30
60
120
300
470
600
DC Resistance
(Ω) max.
0.10
0.25
0.30
0.35
0.40
0.45
0.50
0.70
0.25
0.30
0.35
0.40
0.50
0.60
0.75
0.10
0.12
0.20
0.45
0.45
0.50
Rated Current
(mA) max.
200
200
300
150
100
100
100
50
400
350
250
250
200
200
150
200
200
100
100
100
100
100
Test Frequency
(MHz)
Samwha P/N
CBA3216GA300N4
CBA3216GA600N4
CBA3216GA121N4
CBA3216GA221N4
CBA3216GA301N4
CBA3216GA471N4
CBA3216GA601N4
CBA3216GA102N4
CBA3216GK600N4
CBA3216GK121N4
CBA3216GK221N4
CBA3216GK301N4
CBA3216GK471N4
CBA3216GK601N4
CBA3216GK102N4
CBA3216GM300N4
CBA3216GM600N4
CBA3216GM121N4
CBA3216GM301N4
CBA3216GM471N4
CBA3216GM601N4
※
Measuring Equipment
CHIP BEAD ARRAY Series
-. Z : HP4291B / E4991A
-. Rdc : HP4338B
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
v
3216 SIZE
CBA 3216 GA 300 N4
Impedance [
W
]
60
100
CBA 3216 GA 600 N4
Z
R
X
Impedance [
W
]
200
CBA 3216 GA 121 N4
Z
R
X
Impedance [
W
]
45
75
150
Z
30
50
100
R
15
25
50
X
0
1
10
100
1000
0
1
10
100
1000
0
1
10
100
1000
Frequency [MHz]
Frequency [MHz]
Frequency [MHz]
300
CBA 3216 GA 221 N4
Z
Impedance [
W
]
R
400
CBA 3216 GA 301 N4
Z
Impedance [
W
]
R
800
CBA 3216 GA 601 N4
Z
R
Impedance [
W
]
225
300
600
CHIP BEAD ARRAY Series
150
200
400
75
X
100
X
200
X
1
10
100
1000
0
1
10
100
1000
0
1
10
100
1000
0
Frequency [MHz]
Frequency [MHz]
Frequency [MHz]
1200
CBA 3216 GA 102 N4
Z
Impedance [
W
]
R
240
CBA 3216 GK 121 N4
Z
R
Impedance [
W
]
400
CBA 3216 GK 221 N4
Z
R
X
1
10
100
1000
Impedance [
W
]
900
180
300
600
120
200
300
X
60
X
1
10
100
1000
100
0
1
10
100
1000
0
0
Frequency [MHz]
Frequency [MHz]
Frequency [MHz]
600
CBA 3216 GK 301 N4
Impedance [
W
]
800
CBA 3216 GK 471 N4
Z
R
Impedance [
W
]
1000
CBA 3216 GK 601 N4
Z
Impedance [
W
]
400
Z
R
600
750
R
500
400
200
200
250
X
X
0
1
10
100
1000
0
1
10
100
X
1000
0
1
10
100
1000
Frequency [MHz]
Frequency [MHz]
Frequency [MHz]
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
Reliability & Test Condition
Item
Operating
temperature range
Storage
temperature range
Requirements
- 55
℃
~ + 125
℃
40
℃
max., 70% RH max.
Test Conditions
-
at packing condition
Preheat temperature : 100 ~ 150
℃
Preheat time : 60 sec.
Solder temperature : 245
±
5
℃
Soldering time : 10
±
1 sec.
Solderability
More than 90% of the terminal electrode shall be
covered with new solder
CHIP BEAD, Reliability & Test Condition
Resistance to
soldering heat
1. No damage such as cracks should be
caused in chip element
2. More than 75% of the terminal electrode
shall be covered with new solder
3. Impedance shall not change
more than
±30
%
More than 50% of the terminal electrode
shall be covered with new solder
Preheat temperature : 100 ~ 150
℃
Preheat time : 60 sec.
Solder temperature : 270
±
10
℃
Soldering time : 10
±
0.5 sec.
Reflow soldering
ST
≥
ST
1
CT
3
CT
Preheat temperature : 150
℃
Preheat time : 60 sec.
Solder temperature : 245
±
5
℃
Soldering time : 10 sec. max.
(Reflow soldering profile)
High temperature
resistance
Temperature : 125
±
3
℃
Time : 500
±
12 hours
Measurement at room ambient
temperature after placing for 24 hours
Temperature : 125
±
3
℃
Applied current : rated current
Time : 1000
±
12 hours
Measurement at room ambient
temperature after placing for 24 hours
Temperature : 40
±
2
℃
Humidity : 90
±
2 % RH
Time : 500
±
12 hours
Measurement at room ambient
temperature after placing for 24 hours
High temperature
load resistance
1. No mechanical damage
2. Impedance shall not change more than
±30
%
Humidity
resistance
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
DPS-081104
CHIP BEADS ARRAY
Reliability & Test Condition
Item
Requirements
Test Conditions
Temperature : 40
±
2
℃
Humidity : 90
±
2 % RH
Applied current : rated current
Time : 500
±
12 hours
Measurement at room ambient
temperature after placing for 24 hours
Temperature : -55
±
3
℃
Time : 1000
±
12 hours
Measurement at room ambient
temperature after placing for 24 hours
1. -55
±
3℃ for 30 minutes
2.125
±
3
℃
for 30 minutes
3. repeat 100 cycle
Frequency : 10 ~ 55 Hz
Amplitude : 1.5 mm
Direction : X, Y, Z
Sweep time : 2 hours for each axis
Drop 10 times on a concrete floor
from a height of 100 cm
No mechanical damage
ITEM
Flexure strength
A (mm)
B (mm)
C (mm)
W (kgf)
4 ARRAY
Humidity load
resistance
Low temperature
resistance
1. No mechanical damage
2. Impedance shall not change more than
±30
%
Thermal shock
CHIP BEAD, Reliability & Test Condition
Vibration
Drop
R0.5
Land pattern
B C
A
D
0.8
0.8
3.0
0.4
W
50
20
W
Bending strength
The terminal electrode shall be neither break off
nor the chip damage
R340
2 mm
Resistance meter
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
FPGA/CPLD
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