Registered Bus Transceiver, 1-Func, 8-Bit, Complementary Output, TTL, CDIP28,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP28,.6 |
| Reach Compliance Code | unknown |
| 控制类型 | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL |
| JESD-30 代码 | R-XDIP-T28 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
| 最大I（ol） | 0.1 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-COLLECTOR |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 54F776/BXA | 54F776/BYA | 54F776/B3A | |
|---|---|---|---|
| 描述 | Registered Bus Transceiver, 1-Func, 8-Bit, Complementary Output, TTL, CDIP28, | Registered Bus Transceiver, 1-Func, 8-Bit, Complementary Output, TTL, CDFP28, | Registered Bus Transceiver, 1-Func, 8-Bit, Complementary Output, TTL, CQCC28, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DIP, DIP28,.6 | DFP, FL28,.4 | QCCN, LCC28,.45SQ |
| Reach Compliance Code | unknown | unknown | unknown |
| 控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 代码 | R-XDIP-T28 | R-XDFP-F28 | S-XQCC-N28 |
| JESD-609代码 | e0 | e0 | e0 |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
| 最大I（ol） | 0.1 A | 0.1 A | 0.1 A |
| 位数 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出特性 | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DFP | QCCN |
| 封装等效代码 | DIP28,.6 | FL28,.4 | LCC28,.45SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES |
| 技术 | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 |
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