High Speed CMOS Logic Phase-Locked-Loop with VCO 16-TSSOP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, TSSOP16,.25 |
| 针数 | 16 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Factory Lead Time | 6 weeks |
| 模拟集成电路 - 其他类型 | PHASE LOCKED LOOP |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/6 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电流 (Isup) | 204 mA |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 4.4 mm |
| CD74HC4046APWRE4 | CD74HCT4046AMT | CD74HCT4046AM96 | CD74HCT4046AM | CD74HCT4046AE | CD74HC4046APWT | CD74HC4046AMT | MF04Q1020DVL | CD74HC4046AM | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-TSSOP -55 to 125 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-SOIC -55 to 125 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-SOIC -55 to 125 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-SOIC -55 to 125 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-PDIP -55 to 125 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-TSSOP -55 to 125 | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-SOIC -55 to 125 | Precision Thin Film Chip Resistors | High Speed CMOS Logic Phase-Locked-Loop with VCO 16-SOIC -55 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | - | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | - | 符合 |
| 零件包装代码 | TSSOP | SOIC | SOIC | SOIC | DIP | TSSOP | SOIC | - | SOIC |
| 包装说明 | TSSOP, TSSOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | SOP, SOP16,.25 | DIP, DIP16,.3 | TSSOP, TSSOP16,.25 | SOIC-16 | - | SOP, SOP16,.25 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - | 16 |
| Reach Compliance Code | compli | compli | compliant | compliant | compliant | compliant | compliant | - | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | - | EAR99 | - | EAR99 |
| Factory Lead Time | 6 weeks | 1 week | 6 weeks | 6 weeks | 6 weeks | 6 weeks | 6 weeks | - | 1 week |
| 模拟集成电路 - 其他类型 | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | PHASE LOCKED LOOP | - | PHASE LOCKED LOOP |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | - | R-PDSO-G16 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | - | e4 |
| 长度 | 5 mm | 9.9 mm | 9.9 mm | 9.9 mm | 19.3 mm | 5 mm | 9.9 mm | - | 9.9 mm |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | 1 | 1 | - | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - | -55 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | SOP | SOP | DIP | TSSOP | SOP | - | SOP |
| 封装等效代码 | TSSOP16,.25 | SOP16,.25 | SOP16,.25 | SOP16,.25 | DIP16,.3 | TSSOP16,.25 | SOP16,.25 | - | SOP16,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | NOT SPECIFIED | 260 | 260 | - | 260 |
| 电源 | 2/6 V | 5 V | 5 V | 5 V | 5 V | 2/6 V | 2/6 V | - | 2/6 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.75 mm | 1.58 mm | 1.58 mm | 3.9 mm | 1 mm | 1.75 mm | - | 1.58 mm |
| 最大供电电压 (Vsup) | 6 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 6 V | 6 V | - | 6 V |
| 最小供电电压 (Vsup) | 2 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 2 V | 2 V | - | 2 V |
| 标称供电电压 (Vsup) | 3 V | 5 V | 5 V | 5 V | 5 V | 3 V | 3 V | - | 3 V |
| 表面贴装 | YES | YES | YES | YES | NO | YES | YES | - | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - | MILITARY |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | - | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 0.65 mm | 1.27 mm | - | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 4.4 mm | 3.9 mm | 3.91 mm | 3.91 mm | 6.35 mm | 4.4 mm | 3.9 mm | - | 3.91 mm |
| Base Number Matches | - | - | 1 | 1 | 1 | 1 | 1 | - | 1 |
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