Binary Counter, Synchronous, Bidirectional, CMOS, PDSO20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | SOP, SOP20,.4 |
Reach Compliance Code | unknown |
计数方向 | BIDIRECTIONAL |
JESD-30 代码 | R-PDSO-G20 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
负载/预设输入 | YES |
逻辑集成电路类型 | BINARY COUNTER |
最大频率@ Nom-Sup | 70000000 Hz |
最大I(ol) | 0.024 A |
工作模式 | SYNCHRONOUS |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP20,.4 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 3.3/5 V |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
74AC11191D | 74ACT11191D | 74ACT11191N | 74AC11191N | |
---|---|---|---|---|
描述 | Binary Counter, Synchronous, Bidirectional, CMOS, PDSO20 | Binary Counter, Synchronous, Bidirectional, CMOS, PDSO20, | Binary Counter, Synchronous, Bidirectional, CMOS, PDIP20, | Binary Counter, Synchronous, Bidirectional, CMOS, PDIP20, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | SOP, SOP20,.4 | SOP, SOP20,.4 | DIP, DIP20,.3 | DIP, DIP20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
JESD-30 代码 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 |
JESD-609代码 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF |
负载/预设输入 | YES | YES | YES | YES |
逻辑集成电路类型 | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER |
最大频率@ Nom-Sup | 70000000 Hz | 65000000 Hz | 65000000 Hz | 70000000 Hz |
最大I(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOP | SOP | DIP | DIP |
封装等效代码 | SOP20,.4 | SOP20,.4 | DIP20,.3 | DIP20,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
电源 | 3.3/5 V | 5 V | 5 V | 3.3/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
Base Number Matches | 1 | 1 | 1 | 1 |
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