REVISIONS
LTR
A
DESCRIPTION
Add two vendors, CAGE 24355 and CAGE 17856. Add device type 02. Make
changes to 1.2.1, 1.3, 1.4, and table I, figure 1, and figure 3. Editorial changes
throughout.
Remove vendor, CAGE 24355 from device types 01 and 02. Add device type 03.
Table I changes. Editorial changes throughout.
Update boilerplate to add class V. –rrp
Update to current requirements. Editorial changes throughout. - drw
DATE (YR-MO-DA)
89-11-09
APPROVED
M. A. Frye
B
93-03-02
M. A. Frye
C
D
00-09-07
03-05-01
R. Monnin
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
Rick Officer
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
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STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Charles E. Besore
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
87-01-30
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
MICROCIRCUIT, LINEAR, CMOS, HIGH SPEED
QUAD SPST ANALOG SWITCH, MONOLITHIC
SILICON
AMSC N/A
REVISION LEVEL
D
SIZE
A
SHEET
CAGE CODE
67268
1 OF
13
5962-86716
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E370-03
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
86716
01
E
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
For device class V:
5962
-
86716
01
V
E
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
01
02
03
Generic number
HI201HS
DG271
ADG201HST
Circuit function
High speed quad SPST CMOS analog switch
High speed quad SPST CMOS analog switch
High speed quad SPST CMOS analog switch
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN
class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86716
SHEET
D
2
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
E
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
CQCC1-N20
Terminals
16
20
Package style
Dual-in-line
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/ 2/
Positive supply voltage (V+ to ground):
Device type 01 ............................................................................................... +18 V
Device types 02 and 03 ................................................................................. +25 V
Negative supply voltage (V- to ground):
Device type 01 ............................................................................................... -18 V
Device types 02 and 03 ................................................................................. -25 V
Digital input voltage (V
IN
):
Device types 01 and 03 ................................................................................. V- (-4 V) to V+ (+4 V) or
20 mA, whichever comes first
Device type 02 ............................................................................................... V- (-2 V) to V+ (+2 V) or
20 mA, whichever comes first
Analog input voltage, one switch (V
S
) .............................................................. V- (-2 V) to V+ (+2 V) or
20 mA, whichever comes first
Maximum power dissipation (P
D
):
Device types 01 and 03 ................................................................................. 750 mW 3/
Device type 02 ............................................................................................... 900 mW 4/
Maximum junction temperature (T
J
) ................................................................. +150°C
Lead temperature (soldering, 10 seconds) ...................................................... +275°C
Thermal resistance, junction-to-case (θ
JC
) ....................................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θ
JA
) .................................................. 76°C/W
Storage temperature range .............................................................................. -65°C to +150°C
Peak current, S or D (pulsed at 1 ms, 10 percent duty cycle max):
Device type 01 ............................................................................................... 50 mA
Device type 02 ............................................................................................... 100 mA
Device type 03 ............................................................................................... 70 mA
Continuous current, any terminal (except S or D):
Device type 01 ............................................................................................... 25 mA
Device types 02 and 03 ................................................................................. 20 mA
1.4 Recommended operating conditions.
Positive supply voltage (V+) ..............................................................................
Negative supply voltage (V-) .............................................................................
Minimum high level input voltage (V
IH
):
Device types 01 and 03 .................................................................................
Device type 02 ...............................................................................................
Maximum low level input voltage (V
IL
) ..............................................................
Ambient operating temperature range (T
A
) ......................................................
Ground (GND) ..................................................................................................
+15 V dc
-15 V dc
2.4 V dc
2.0 V dc
0.8 V dc
-55°C to +125°C
0 V dc
1/
2/
3/
4/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Unless otherwise specified, all voltages are referenced to ground.
Derate case E, 8 mW/°C above T
A
= +75°C. Derate case 2, 10 mW/°C above T
A
= +75°C.
Derate case E, 12 mW/°C above T
A
= +75°C. Derate case 2, 10 mW/°C above T
A
= +75°C.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86716
SHEET
D
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device
class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Functional diagram. The functional diagram shall be as specified on figure 2.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical
performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient
operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests
for each subgroup are defined in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86716
SHEET
D
4
TABLE I. Electrical performance characteristics.
Conditions
-55°C
≤
T
A
≤+125°C
V+ = +15 V dc, V- = -15 V dc
unless otherwise specified
T
A
= +25°C
2/
Test
Symbol
Group A
subgroups
Device
type
Limits 1/
Unit
Min
Analog signal range
ON resistance
V
S
R
DS(ON)
4
1
2, 3
1
2, 3
1
2, 3
1
2, 3
1
2, 3
1
2, 3
1
2, 3
Low level input voltage
3/
High level input voltage
3/
Input leakage current
(low)
V
IL
7, 8
02, 03
02
03
All
02, 03
02
03
Channel ON leakage
current
I
D(ON)
V
D
= V
S
=
±14
V,
V
IN
= 0.8 V
01
02, 03
02
03
Drain OFF leakage
current
I
D(OFF)
V
S
=
±14
V, V
D
=
±14
V,
V
IN
= 2.4 V
V
D
=
±14
V, V
S
=
±14
V,
V
IN
= 2.4 V
01
01
All
All
Max
±15
50
75
±10
±100
±1
±100
±60
±10
±100
±1
±100
±60
±10
±100
±1
±100
±60
0.8
V
Ω
nA
V
S
=
±10
V, I
D
= 1 mA,
V
IN
= 0.8 V
V
S
=
±14
V, V
D
=
±14
V,
V
IN
= 2.4 V
V
D
=
±14
V, V
S
=
±14
V,
V
IN
= 2.4 V
Source OFF leakage
current
I
S(OFF)
nA
nA
V
V
IH
7, 8
01, 03
02
2.4
2.0
±500
±1
±10
±1
V
µA
I
IL
V
IN
under test = 0.8 V,
All other V
IN
= 4.0 V
V
IN
under test = 0 V,
All other V
IN
= 2.0 V
V
IN
under test = 1.0 V,
All other V
IN
= 16.5 V,
V
S
=
±17
V
1, 2, 3
1
2, 3
1, 2, 3
01
02
03
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-86716
SHEET
D
5
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