REVISIONS
LTR
A
DESCRIPTION
Changes in accordance with NOR 5962-R227-93.
DATE (YR-MO-DA)
93-09-30
APPROVED
Michael A. Frye
B
Added packages Z and U and device types 04,05, and 06 to drawing.
Updated boilerplate. - glg
Added packages T and N. Added radiation features to appropriate
paragraphs. Updated boilerplate paragraphs. ksr
Corrected dose rate to 0.1 rads(Si)/s. Updated boilerplate
paragraphs. ksr
00-05-30
Raymond Monnin
C
01-12-18
Raymond Monnin
D
02-04-15
Raymond Monnin
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
D
17
D
18
REV
SHEET
PREPARED BY
Jeff Bowling
D
19
D
20
D
21
D
1
D
22
D
2
D
23
D
3
D
24
D
4
D
25
D
5
D
26
D
6
D
27
D
7
D
28
D
8
D
29
D
9
D
30
D
10
D
11
D
12
D
13
D
14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY All
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Jeff Bowling
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS, 16K x 9
PARALLEL FIFO, MONOLITHIC
SILICON
SIZE
A
SHEET
CAGE CODE
93-06-09
REVISION LEVEL
D
67268
5962-93177
1 OF 30
5962-E257-02
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q
and M), space application (device class V). A choice of case outlines and lead finishes are available and are reflected in
the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are
reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
Federal
stock class
designator
\
D
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels
and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535,
appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA
device.
1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
03
04
05
06
Generic number 1/
7206
7206
7206
7206
72061
72061
Circuit function
Access time
50 ns
30 ns
20 ns
15 ns
30 ns
15 ns
93177
01
Device
type
(see 1.2.2)
Q
Device
class
designator
(see 1.2.3)
X
Case
outline
(see 1.2.4)
A
Lead
finish
(see 1.2.5)
/
16K x 9 parallel CMOS FIFO
16K x 9 parallel CMOS FIFO
16K x 9 parallel CMOS FIFO
16K x 9 low power parallel CMOS FIFO
16K x 9 low power parallel CMOS FIFO
16K x 9 low power parallel CMOS FIFO
1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance
level as follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Q, V
1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
X
GDIP1-T28 or CDIP2-T28
28
Dual-in-line
Y
CQCC1-N32
32
Rectangular leadless chip carrier
Z
GDFP2-F28
28
Flat package
U
GDIP4-T28 or CDIP3-T28
28
Dual-in-line
T
See figure 1
28
Dual-in-line
N
See figure 1
28
Flat package
_________________
1/ Generic numbers are also listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this
document and will also be listed in MIL-HDBK-103 and QML-38535 (see 6.6 herein).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
D
5962-93177
SHEET
2
DSCC FORM 2234
APR 97
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 2/
Supply voltage range .................................................................
DC output current.......................................................................
Storage temperature range........................................................
Maximum power dissipation (P
D
) ...............................................
Lead temperature (soldering, 10 seconds) ................................
Thermal resistance, junction-to-case (Θ
JC
) ................................
Junction temperature (T
J
) ..........................................................
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) ........................................................
Minimum high level input voltage (V
IH
).......................................
Maximum low level input voltage (V
IL
)........................................
Case operating temperature range (T
C
).....................................
1.5 Radiation features
Maximum total dose available (dose rate = 0.1 rads(Si)/s) ......................................
Dose rate upset ........................................................................................................
Dose rate survivability ..............................................................................................
Single event phenomenon (SEP) effective
linear energy threshold (LET) with no upsets .........................................................
with no latch-up ......................................................................................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form
a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those
listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto,
cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
> 1.0 x 10 rads(Si)
6/
6/
> 1 MeV-cm /mg 7/
2
> 100 MeV-cm /mg
2
4
-0.5 V dc to +7.0 V dc
50 mA
-65°C to +150°C
2.0 W
+260°C
See MIL-STD-1835
+150°C 3/
4.5 V dc to 5.5 V dc
2.2 V dc 4/
0.8 V dc 5/
-55°C to +125°C
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
_____________
2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at
the maximum levels may degrade performance and affect reliability.
3 / Maximum junction temperature may be increased to +175°C during burn-in and steady-state life.
4/
5/
6/
7/
For
XI
input, V
IH
= 2.8 V dc .
1.5 V dc undershoots are allowed for 10 ns once per cycle.
When a value is determined per customer requirements, it shall be provided.
Contact the device manufacturer for detailed lot information.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
D
5962-93177
SHEET
3
DSCC FORM 2234
APR 97
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of
the DoDISS cited in the solicitation. Unless otherwise specified, the issues of documents not listed in the DoDISS are the
issues of the documents cited in the solicitation.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM Standard F1192-95
-
Standard Guide for the Measurement of Single Event Phenomena from
Heavy Ion Irradiation of Semiconductor Devices.
(Applications for copies of ASTM publications should be addressed to the American Society for Testing and Materials,
1916 Race Street, Philadelphia, PA 19103.)
ELECTRONIC INDUSTRIES ALLIANCE (EIA)
JEDEC Standard EIA/JESD78
-
IC Latch-Up Test.
(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard,
Arlington, VA 22201.)
(Non-Government standards and other publications are normally available from the organizations that prepare or
distribute the documents. These documents also may be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535, and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements
for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device
class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and on figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under
document revision level control and shall be made available to the preparing and acquiring activity upon request.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
D
5962-93177
SHEET
4
DSCC FORM 2234
APR 97
3.2.5 Timing waveforms. The switching test circuit and waveforms shall be as specified on figure 4.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over
the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The
electrical tests for each subgroup are defined in table I. Unless otherwise specified, the values specified in table I are the
preirradiation and postirradiation values. Postirradiation electrical measurements for any RHA level are tested at, T
A
=
+25°C.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also
be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to
space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this
option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-
PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as
required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class
M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply
in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved
source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the
requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and
herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535
or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this
drawing.
3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see
6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-PRF-38535 appendix A.
3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity
retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation
shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 105 (see MIL-PRF-38535, appendix A).
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance
with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection
procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be
conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening
shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality
conformance inspection.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
SIZE
A
REVISION LEVEL
D
5962-93177
SHEET
5
DSCC FORM 2234
APR 97
FPGA/CPLD
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