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74LVC1G57GW-Q100

产品描述IC SPECIALTY LOGIC CIRCUIT, Logic IC:Other
产品类别逻辑    逻辑   
文件大小123KB,共16页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
下载文档 详细参数 选型对比 全文预览

74LVC1G57GW-Q100概述

IC SPECIALTY LOGIC CIRCUIT, Logic IC:Other

74LVC1G57GW-Q100规格参数

参数名称属性值
厂商名称NXP(恩智浦)
包装说明TSSOP,
Reach Compliance Codeunknown
系列LVC/LCX/Z
JESD-30 代码R-PDSO-G6
长度2 mm
逻辑集成电路类型LOGIC CIRCUIT
功能数量1
端子数量6
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
筛选级别AEC-Q100
座面最大高度1.1 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.65 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级AUTOMOTIVE
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
宽度1.25 mm

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74LVC1G57-Q100
Low-power configurable multiple function gate
Rev. 1 — 15 April 2014
Product data sheet
1. General description
The 74LVC1G57-Q100 provides configurable multiple functions. Eight patterns of 3-bit
input, determine the output state. The user can choose the logic functions AND, OR,
NAND, NOR, XNOR, inverter and buffer. All inputs can be connected to V
CC
or GND.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this
device in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using I
OFF
.
The I
OFF
circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
All inputs (A, B and C) are Schmitt trigger inputs that can transform slowly changing input
signals into sharply defined, jitter-free output signals.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from
40 C
to +85
C
and from
40 C
to +125
C
Wide supply voltage range from 1.65 V to 5.5 V
5 V tolerant input/output for interfacing with 5 V logic
High noise immunity
Complies with JEDEC standard:
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8B/JESD36 (2.7 V to 3.6 V).
ESD protection:
MIL-STD-883, method 3015 exceeds 2000 V
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0
)
24
mA output drive (V
CC
= 3.0 V)
CMOS low power consumption
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Inputs accept voltages up to 5 V
Multiple package options

74LVC1G57GW-Q100相似产品对比

74LVC1G57GW-Q100 74LVC1G57GV-Q100 74LVC1G57GV-Q100,125 74LVC1G57GW-Q100,125
描述 IC SPECIALTY LOGIC CIRCUIT, Logic IC:Other IC SPECIALTY LOGIC CIRCUIT, Logic IC:Other Logic Circuit, CMOS, PDSO6 Logic Circuit, CMOS, PDSO6
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦)
包装说明 TSSOP, TSSOP, TSOP-6 SOT-363, 6 PIN
Reach Compliance Code unknown unknown unknown unknown
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6 R-PDSO-G6
长度 2 mm 2.9 mm 2.9 mm 2 mm
逻辑集成电路类型 LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT LOGIC CIRCUIT
功能数量 1 1 1 1
端子数量 6 6 6 6
最高工作温度 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP TSOP TSSOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
筛选级别 AEC-Q100 AEC-Q100 AEC-Q100 AEC-Q100
座面最大高度 1.1 mm 1.1 mm 1.1 mm 1.1 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 1.65 V 1.65 V 1.65 V 1.65 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.95 mm 0.95 mm 0.65 mm
端子位置 DUAL DUAL DUAL DUAL
宽度 1.25 mm 1.5 mm 1.5 mm 1.25 mm

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