电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CHP1/8-503120D13LF

产品描述Fixed Resistor, Metal Glaze/thick Film, 0.25W, 312ohm, 200V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小382KB,共3页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
标准
下载文档 详细参数 全文预览

CHP1/8-503120D13LF概述

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 312ohm, 200V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 1206, ROHS COMPLIANT

CHP1/8-503120D13LF规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称TT Electronics plc
包装说明, 1206
Reach Compliance Codecompliant
ECCN代码EAR99
JESD-609代码e1
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
封装形状CYLINDRICAL PACKAGE
包装方法TR, 13 INCH
额定功率耗散 (P)0.25 W
额定温度70 °C
电阻312 Ω
电阻器类型FIXED RESISTOR
尺寸代码1206
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数50 ppm/°C
端子面层Tin/Silver/Copper (Sn96.0Ag3.5Cu0.5)
端子形状WRAPAROUND
容差0.5%
工作电压200 V
Base Number Matches1

文档预览

下载PDF文档
Cylindrical High Power
Surface Mount Metal Glaze™
CHP Series
·
Cylindrical High Power
Up to 2 watts
·
Surface Mount Metal Glaze
TM
Up to 1000 volts
·
0.2 ohm to 2.2 megohm range
·
Up to 2 watts
RoHS-compliant version available
·
Up to 1000 volts
150°C maximum operating temperature
0.2 ohm to 2.2 megohm range
RoHS-compliant version available
150°C maximum operating temperature
CHP
Metal Glaze™
thick fi lm element
fi red at 1000°C
to solid ceramic
Metal Glaze
TM
thick film element
fired at 1000°C
to solid ceramic
Solder over
nickel barrier
Solder over
nickel barrier
High
temperature
dielectric
coating
High
temperature
dielectric
coating
Electrical Data
IRC
Type
Indus-
try
Foot-
print
1206
Size
Code1
Maximum
Power Rating
Working
Voltage²
Maximum
Voltage
Resistance
Range (ohms)³
0.1 to 0.99
CHP 1/8
B&C
1/4W @ 70°C
200
400
1.0 to 1.0 M
20 to 348K
CHP 1/2
2010
D&E
1/2W @ 70°C
300
600
0.1 to 0.99
1.0 to 348K
0.1 to 0.99
CHP 1
2512
F
1W @ 70°C
350
700
1.0 to 2.21M
20 to 348K
CHP 2
3610
H
2W @ 25°C
1.33W @ 70°C
500
1000
0.2 to 0.99
1.0 to 2.21M
²Not to exceed
P x R
Product
Category
Low Range
Standard
Tight Tolerance
Low Range
Standard
Low Range
Standard
Tight Tolerance
Low Range
Standard
Tolerance
(±%)³
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
1, 2, 5
1, 2, 5
0.25, 0.5
1, 2, 5
1, 2, 5
TCR
(ppm/°C)³
100
50, 100
50, 100
100
50, 100
100
50, 100
50, 100
100
50, 100
¹See pages 2 & 3 for product dimensions, recommended solder pads, and standard packaging.
³Consult factory for tighter TCR, tolerance, or resistance values.
Environmental Data
Characteristics
teristics
Charac
Thermal Shock
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Maximum
m Change
Maximu
Change
±0.25% +.01 Ω
As specified
±0.5% + 0.01 ohm
±0.25% +.01 Ω
±0.25% + 0.01 ohm
±0.5% +.01 Ω
Test Method
MIL-PRF-55342H, §4.8.3
Test Method
MIL-R-55342H Par 3.16 (-55°C +
+150°C / -65°C)
(MIL-STD-202, Method 107G:
125°C)
MIL-PRF-55342H, §4.8.5
MIL-R-55342H Par 3.9 (-65°C + 150°C, 5 cycles)
(-65°C)
MIL-R-55342H Par 3.11 (-65°C @ working voltage)
MIL-R-55342H Par 3.12
2.5 x
P x R
for 5 seconds
MIL-PRF-55342H, §4.8.7
MIL-R-55342H Par 3.13 (-150°C for 100 hours)
MIL-R-55342H Par 3.14.2 (
Reflow soldered to board at 260°C for 10 seconds
)
MIL-PRF-55342H, §4.8.8.2
Short Time Overload
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding
Exposure
±1%
+ 0.01 ohm
±0.5%
for R>100KΩ
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
MIL-PRF-55342H, §4.8.6
(150°C x 100 Hours)
Resistance to Bonding Exposure
Moisture Resistance
Solderability
High Temperature Exposure
±0.5% +.01 Ω
±0.25% +.01 Ω
±0.5% +.01 Ω
As specified
MIL-PRF-55342H, §4.8.8.2
95% minimum coverage
±0.5% + 0.01 ohm
Temperature Coefficient
Life Test
Resistance
Moisture
Life Test
Solderability
Terminal Adhesion Strength
MIL-PRF-55342H, §4.8.10
(MIL-STD-202, Method 304)
MIL-R-55342H Par 3.18 (10 cycles, total 240 hours)
MIL-R-55342H Par 3.15 (2000 hours at 70°C intermittent)
(MIL-STD-202, Method 108A: 2000 Hours @ 70°C)
1200 gram push from underside of mounted chip for 60 seconds
(MIL-STD-202, Method 208H)
MIL-STD-202, Method 208 (245°C for 5 seconds)
(MIL-STD-202, Method 106G)
±1%
+ 0.01
±0.5%
+.01 Ω
ohm
±1% +
minimum coverage
95%
0.01 ohm
no mechanical damage
MIL-PRF-55342H, §4.8.11
MIL-PRF-55342H, §4.8.12
±1% +.01 Ω
IRC – defined
Chip mounted in center of 90mm long board, deflected 1mm so as to
Terminal Adhesion Strength (push)
±1% + 0.01 ohm
(no mechanical damage)
exert pull on chip contacts for 5 seconds
1200 gram push from underside of mounted device for 60 sec
no mechanical damage
IRC-defined
±1% +.01 Ω
General Note
Device mounted in center of 90mm long board, deflected 1 mm to exert
Terminal Adhesion Strength (flex)
cation without notice or liability.
IRC reserves the right to make changes in product specifi
(no mechanical damage)
All information is subject to IRC’s own data and is considered accurate at time of going to print.
pull on contacts for 5 seconds
A subsidiary of
© IRC Wire and Film Technologies Division
General Note
Telephone:
Facsimile:
Website: www.irctt.com
rpus Christi Te
TT electronics plc
ries Issue March
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09.12
认识A类B类AB类功率放大电路的基础,,,,
A类A类放大器是最简单的放大器类型,对于任何输出波形,其输出级的晶体管始终处于导通状态(不会完全关断)。这类放大器具有极佳的线性特性,但效率很低。B类B类放大器的输出级晶体管只在信号波形 ......
fish001 模拟与混合信号
如何从单片机过度到ARM
如今嵌入式领域越来越大,生活中处处可见。但是学习单片机容易,感觉ARM有些难度,ARM现在非常流行,发展也很快,希望能学好ARM,但是自己不知如何从单片机过度到ARM,该如何学习及应该学习哪本 ......
fsbbsf ARM技术
STM103VC哪有卖,零售价格多少?
STM103VC哪有卖,零售价格多少?文档看到好久了,但零售还没有?...
小猪崽 stm32/stm8
求教linux 驱动
本人菜鸟一枚,正在学习嵌入式linux,老师交个任务,要求写一个用户程序对内存空间地址的读写的linux驱动程序。看过一些驱动的原理,主要是定义一些功能跟函数,还有注册设备。但对具体的操作不 ......
ludian320 Linux开发
[XMC4700 Relax 5V shield 评测]06 基于BMP180的气压计
2017-12-31在上次评测中,已经搞定了液晶显示屏了,是时候提供点内容了。考虑到和DAVE的结合,放弃了那些单总线协议的传感器,使用I2C接口的BMP180来完成一个简单的气压计设计。 模块外观如下 ......
johnrey 单片机
VGA接口问题
小弟我是FPGA的初学者,请问一下做VGA接口实验时,是不是先要把电脑的屏幕刷新频率和分辨率设置好?还有,显示器用另一台笔记本可以吗?...
woaizhudi FPGA/CPLD

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1907  2004  1857  1456  2882  4  24  6  3  30 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved