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5962-8866202UX: 产品描述Standard SRAM, 32KX8, 70ns, CMOS, CQCC28,; 产品类别存储存储; 文件大小165KB，共22页; 制造商TEMIC; 官网地址http://www.temic.de/

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5962-8866202UX概述

Standard SRAM, 32KX8, 70ns, CMOS, CQCC28,

5962-8866202UX规格参数

参数名称	属性值
厂商名称	TEMIC
Reach Compliance Code	unknown
最长访问时间	70 ns
I/O 类型	COMMON
JESD-30 代码	R-XQCC-N28
内存密度	262144 bit
内存集成电路类型	STANDARD SRAM
内存宽度	8
端子数量	28
字数	32768 words
字数代码	32000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	32KX8
输出特性	3-STATE
封装主体材料	CERAMIC
封装代码	QCCN
封装等效代码	LCC28,.35X.55
封装形状	RECTANGULAR
封装形式	CHIP CARRIER
并行/串行	PARALLEL
电源	5 V
认证状态	Not Qualified
筛选级别	38535Q/M;38534H;883B
最大待机电流	0.02 A
最小待机电流	4.5 V
最大压摆率	0.105 mA
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	NO LEAD
端子节距	1.27 mm
端子位置	QUAD
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Changes in accordance with NOR 5962-R076-92.

Redrawn with changes. Add devices 05 through 09. Add vendor

CAGE number 6Y440 to device types 01 through 04, N package only,

device types 05 through 09 X,Y,T, U and N. Add vendor CAGE

number 04713 to device types 02,03, and 04, X package only. Add

vendor CAGE number 65786 to device types 03 through 06 packages

X, Y, U, N, and M, and to device types 07 and 08, packages Y, U, N,

and M. Add vendor CAGE number 61772 to devices 05 and 06,

packages X, Y, M, N and U. Add vendor CAGE number 0K6N4 to

device types 03 through 08 packages Y,U,N, and M. Remove vendor

CAGE numbers 0BK02 and 0BYV4 from the drawing. Editorial

changes throughout.

Changes in accordance with NOR 5962-R098-95

Boilerplate update, part of 5 year review. ksr

DATE (YR-MO-DA)

91-11-26

93-0217

APPROVED

Ray Monnin

M. A. Frye

95-04-14

07-10-02

M. A. Frye

Robert M. Heber

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth S. Rice

CHECKED BY

Ray Monnin

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

AMSC N/A

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

88-09-27

REVISION LEVEL

SIZE

SHEET

DSCC FORM 2233

APR 97

MICROCIRCUIT, MEMORY, DIGITAL,

CMOS, 32K X 8 STATIC RAM (SRAM),

MONOLITHIC SILICON

CAGE CODE

67268

1 OF

5962-88662

5962-E598-07

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific

exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-

JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer

Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-

38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity

approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make

modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These

modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535

is required to identify when the QML flow option is used.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535, appendix A and herein.

3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.2 Truth table. The truth table shall be as specified on figure 2.

3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only.

Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the

internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor

testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements

as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are

as specified in table I and shall apply over the full case operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical

tests for each subgroup are described in table I.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-88662

SHEET

5962-8866202UX

5962-8866202UX概述

5962-8866202UX规格参数

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