REVISIONS
LTR
A
DESCRIPTION
Page 4, table I; delete temperature stability test. Add long term stability test.
Electrical changes throughout table I. Editorial changes throughout.
Add case outline 2. Add vendor CAGE 34333. Make corrections to load
regulation and output voltage test conditions. Also correct short-circuit current,
output source current, and RAMP bias current test limits. Change RAMP
voltage-valley and RAMP voltage-valley to peak, delay to output, and charge
current test limits. Editorial changes throughout.
Add device types 02 and 03. Editorial changes throughout.
Changes in accordance with N.O.R. 5962-R196-94.
Changes in accordance with N.O.R. 5962-R202-95.
Changes in accordance with N.O.R. 5962-R160-97.
Add device class V devices. Redrawn. - ro
Add case outline “F”. Make correction to the V
OH1
test condition under the
Error amplifier section as specified in table I. - ro
Drawing updated to reflect current requirements. - ro
DATE (YR-MO-DA)
88-11-09
APPROVED
M. A. FRYE
B
90-05-29
M. A. FRYE
C
D
E
F
G
H
J
94-05-03
94-06-02
95-10-05
97-01-07
00-06-08
02-07-19
07-11-14
M. A. FRYE
M. A. FRYE
M. A. FRYE
R. MONNIN
R. MONNIN
R. MONNIN
R. HEBER
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
J
15
REV
SHEET
J
1
J
2
J
3
J
4
J
5
J
6
J
7
J
8
J
9
J
10
J
11
J
12
J
13
J
14
PREPARED BY
MARCIA B. KELLEHER
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
ROBERT R. EVANS
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
MICHAEL A. FRYE
DRAWING APPROVAL DATE
88-02-09
MICROCIRCUIT, LINEAR, HIGH SPEED PULSE
WIDTH MODULATOR CONTROLLER,
MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
J
SIZE
A
SHEET
CAGE CODE
67268
1 OF
15
5962-87681
DSCC FORM 2233
APR 97
5962-E661-07
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or
Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
87681
01
E
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
For device class V:
5962
-
87681
01
V
E
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
Generic number
1825
1825A
1825B
Circuit function
High speed PWM controller
High speed PWM controller
High speed PWM controller
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87681
SHEET
J
2
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
X
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC1-N28B
CQCC1-N20
Terminals
16
16
28
20
Package style
Dual-in-line
Flat pack
Square leadless chip carrier with
thermal pads
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (V
CC
):
Device type 01 ...............................................................................
Device types 02 and 03 .................................................................
DC output current, source or sink .....................................................
Pulse output current, source or sink (0.5
μs)
.....................................
Analog input voltage:
NONINVERTING, INVERTING, and RAMP pins ...........................
SOFT START and CURRENT LIMIT / SD pins .............................
Clock output current ..........................................................................
Error amplifier output current ............................................................
Soft start sink current ........................................................................
Oscillator charging current ................................................................
Power dissipation (P
D
) (all packages) ...............................................
Storage temperature range ...............................................................
Lead temperature (soldering, 10 seconds) ........................................
Junction temperature (T
J
) .................................................................
30 V dc
22 V dc
0.5 A
2.0 A
-0.3 V dc to 7.0 V dc
-0.3 V dc to 6.0 V dc
-5.0 mA
5.0 mA
20 mA
-5.0 mA
1.0 W 2/ 3/
-65°C to +150°C
+300°C
+150°C
Thermal resistance, junction-to-case (θ
JC
) ....................................... See MIL-STD-1835
1.4 Recommended operating conditions.
Supply voltage range:
Device type 01 ............................................................................... 10 V dc to 30 V dc
Device types 02 and 03 ................................................................. 12 V dc to 22 V dc
Ambient operating temperature range (T
A
) ....................................... -55°C to +125°C
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ For case outline E, derate linearly above T
A
= +60°C at 11 mW/°C; for case outlines 2 and X, derate linearly above
T
A
= 40°C at 9 mW/°C; for case outline F, derate linearly above T
A
= +60°C at 8 mW/°C.
3/
Must withstand the added P
D
due to short circuit test, e.g., I
SC
.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87681
SHEET
J
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Block diagrams. The block diagrams shall be as specified on figure 2.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87681
SHEET
J
4
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
Unit
Reference section
Output voltage
Line regulation
V
REF
V
RLINE
T
J
= +25°C, I
O
= 1.0 mA
10 V
<
V
CC
<
30 V
12 V
<
V
CC
<
20 V
Load regulation
Long term stability 2/
Total output variation
V
RLOAD
ΔV
REF
/
Δt
V
OM1
V
OM2
V
OM3
V
OM4
Short-circuit current
I
SC
1.0 mA
<
I
O
<
10 mA
T
J
= +125°C, t = 1000 hrs.
I
O
= -1.0 mA, V
CC
= 10 V
I
O
= -1.0 mA, V
CC
= 30 V
I
O
= -10 mA, V
CC
= 10 V
I
O
= -10 mA, V
CC
= 30 V
V
REF
= 0 V
1,2,3
01
02,03
Oscillator section
Initial accuracy
f
o
T
J
= +25°C
4
01
02,03
Voltage stability
Δf
o
/
ΔV
10 V
<
V
CC
<
30 V
12 V
<
V
CC
<
20 V
Total variation
f
OM1
f
OM2
Clock out high
V
CLK(H)
V
CC
= 10 V
V
CC
= 30 V
1,2,3
01
02,03
Clock out low
V
CLK(L)
1,2,3
01
02,03
See footnotes at end of table.
3.9
3.7
2.9
0.2
V
V
4,5,6
4,5,6
01
02,03
All
340
360
375
440
425
±2.0
±1.0
460
kHz
%
kHz
-15
30
-100
90
mA
1,2,3
2
1,2,3
1
1,2,3
All
01
02,03
All
All
All
5.00
5.05
5.15
±20
±15
±20
±25
5.20
mV
mV
V
V
mV
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87681
SHEET
J
5
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