• Supports 1310 nm and 1550 nm multi-rate applications
• Operates from −40°C to 85°C
• Includes differential output
• Supports received signal strength indicator (RSSI) function
Applications
• 10 G Ethernet 10GBASE-LR/ER
• SONET OC-192 SR1/IR2
Compliance
• RoHS 6
The high-reliability JDSU 1310/1550 nm 10 G XFP ROSA receiver optical
sub-assembly (ROSA) product, designed specifically for the XFP transceiver,
provides excellent performance over extended operating temperatures in
high-speed applications up to 10 G. The product integrates PIN and TIA chips in
a custom hermetic TO46 package. Each device is actively aligned to a precision
OSA housing using a proprietary alignment algorithm and is tested to precise
requirements. An optional, controlled-impedance flex OSA-PCBA connector
provides the user with optimum performance.
north america
:
800 498-JDSU (5378)
worlDwiDe
:
+800 5378-JDSU
webSite
:
www.jdsu.com
1310/1550 nm 10 G XFP ROSA
2
Dimensions Diagram
Specifications in mm unless otherwise noted.
5.73
0.87
R3.30
BARREL
KEYING
FEATURE
0.58
4.00
2X 13.85
2.95
4.90
2.97
2.92
2.92
5.84
A
ID OF LC
RECEPTACLE
OPTICAL REF PLANE
1.10
3X 13.46
+0.35
4.76
- 0.25
6.44
2X 57°
PIN 5
PIN 4
2X
0.25
2.54
3X
0.44
PIN 3
0.50 A
RXTO ASSY
1.40
PIN 2
2X 82°
PIN 1
Pinout
Pin
1
2
3
4
5
Symbol
OUT+
Vcc
RSSI
OUT−
GND
Description
Non-inverting output
Power supply
Received signal strength indicator
Inverting output
Case & RF ground
10 MAX ROTATIONAL
MISALIGNMENT BETWEEN
RXTO ASSEMBLY AND BARREL
Electrical Schematics for Flexible
Printed Circuit (FPC)
Pinout
Pin
1
2
3
4
5
6
7
8
Symbol
GND
Vcc
GND
VOUT −N
VOUT +P
GND
Monitor
GND
Note: Pin definition for FPC can open to customer design
1310/1550 nm 10 G XFP ROSA
3
Absolute Maximum Ratings
Parameter
Storage temperature
Operating case temperature (T
op
)
Supply voltage
Voltage at either output
Current into any input or output
ESD threshold (HBM)
Maximum incident optical power
Note: All specifications are at T
op
= 25°C unless otherwise stated
Symbol
T
STG
T
op
V
cc
V
IO
I
IO
V
ESD
P
O
Rating
−40 to +85°C
−40 to +85°C
−0.3 to 4.0 V
−0.3 to 4.0 V
−8 to 8 mA
300 V
+4.5 dBm
Specifications
Parameter
TIA supply voltage
TIA supply current
Wavelength
Photodiode responsivity
Single ended output impedance
Power consumption
RSSI offset current (no light)
1
RSSI gain internal bias
Data rate
RF bandwidth (−3 dB)
Low frequency cut-off (−3 dB)
Sensitivity average power
Stressed sensitivity OMA
XFP-SR1
XFP-IR2
Overload
Optical return loss
XFP-SR1
XFP-IR2
Transimpedance (single-ended)
Maximum differential
output voltage
TIA input referred RMS noise
Symbol
V
cc
I
cc
l
R
Z
out
P
e
Id
RSSI
A
RSSI
B
BW
f
c
, low
Sens_Avg
SRS_10GbaseL
SRS_10GbaseE
P
max
ORL
Z
T
V
out, D, Max
Conditions
V
cc
=3.3 V
Measured at 1310 nm
Minimum
3.15 V
-
1260 nm
0.75 A/W
40
W
-
3.5 µA
0.48 A/A
9.95 G
7 GHz
-
Typical
3.30 V
28 mA
-
-
50
W
100 mW
10 µA
0.50 A/A
-
-
30 KHz
Maximum
3.45 V
41mA
1565 nm
-
60
W
-
16 µA
0.52 A/A
11.35 G
-
100 KHz
Small signal bandwidth
10.709 G, NRZ, PRBS 2
31
−1
1550 nm, ExtRatio>10 dB, BER=10
-12
-
IEEE802.3ae, 10GBase-L stress
IEEE802.3ae, 10GBase-E stress
10.709 G, NRZ, PRBS 2
31
−1,
1260 – 1355 nm, Ext Ratio=13.0 dB,
BER=10
-12
1290 – 1330 nm
1530 – 1565 nm
10 GHz bandwidth
−19.5 dBm -
−16 dBm
−16 dBm
-
-
-
7000
W
280 mV
PP
0.9 µA
-
-
-
-
-
1.5 dBm
-
-
5000
W
240 mV
PP
-
−14 dB
−28 dB
10000
W
350 mV
PP
1.6 µA
Note: All parameters are over temperature and end-of-life unless otherwise stated.
1. The RSSI (received signal strength indicator) function is used to mirror the photodiode output with an analog current output. This current has been defined at certain pro-
portion ratio to the photodiode output current. This function requires a resistive load to ground (GND). The voltage gain can be adjusted for the intended application by
choosing different external resistor.
Offset is added to improve accuracy below 5 µA. When measured without input current (no light) the offset can be subtracted as a constant offset from RSSI measure-
ments. RSSI current output will operate from sensitivity to overload.
1310/1550 nm 10 G XFP ROSA
Electrostatic Discharge (ESD)
ESD protection is imperative. Use of grounding straps, antistatic mats, and other standard ESD protective equipment is
required when handling or testing a junction photodiode. Fiber pigtail should be handled with less than 10 N pull and with
bending radius greater than one inch. Soldering temperature of the leads should not exceed 260°C for more than 10 seconds.
Ordering Information
For more information on this or other products and their availability, please contact your local JDSU account manager or JDSU
directly at 1-800-498-JDSU (5378) in North America and +800-5378-JDSU worldwide, or via e-mail at customer.service@jdsu.com.
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