1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
1 组成, 22 uH, 瓷芯, 通用电感, 表面贴装
参数名称 | 属性值 |
额定感应系数 | 22 µH |
功能数量 | 1 |
端子数量 | 2 |
最小工作温度 | -20 Cel |
最大工作温度 | 85 Cel |
自谐振频率 | 18 MHz |
加工封装描述 | CHIP, 1008, ROHS COMPLIANT |
欧盟RoHS规范 | Yes |
状态 | EOL |
电感类型 | GENERAL PURPOSE INDUCTOR |
case_size_code | 1008 |
结构 | Molded Chip |
核心材料 | CERAMIC |
直流电阻 | 4 ohm |
电感应用 | RF INDUCTOR |
jesd_609_code | e2 |
制造商系列 | PC |
ckage_heigh | 1.6 mm |
ckage_length | 2.5 mm |
ckage_style__meter_ | SMT |
ckage_width | 2 mm |
cking_method | TR |
1额定值的最小品质因数 | 20 |
最大额定电流 | 0.1600 A |
series | ELJ-P |
形状大小描述 | RECTANGULAR PACKAGE |
隔离 | NO |
表面贴装 | YES |
端子涂层 | TIN COPPER |
端子布局 | DUAL ENDED |
端子形状 | J BEND |
测试频率 | 2.52 MHz |
偏差 | 10 % |
CMDSH2-3 | CDRH3D16-220 | ELJPC220KF | LQH3C220 | SM8237 | LEM2520-220 | LB2012B220M | CMDSH-3 | BAT54 | |
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描述 | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD | 1 ELEMENT, 22 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD | 0.1 A, SILICON, SIGNAL DIODE | 0.2 A, 30 V, SILICON, SIGNAL DIODE |
额定感应系数 | 22 µH | 22 µH | 22 µH | 22 µH | 22 µH | 22 µH | - | - | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
端子数量 | 2 | 2 | 2 | 2 | 2 | 2 | - | - | 3 |
最小工作温度 | -20 Cel | -20 Cel | -20 Cel | -20 Cel | -20 Cel | -20 Cel | - | - | - |
最大工作温度 | 85 Cel | 85 Cel | 85 Cel | 85 Cel | 85 Cel | 85 Cel | - | - | - |
自谐振频率 | 18 MHz | 18 MHz | 18 MHz | 18 MHz | 18 MHz | 18 MHz | - | - | - |
加工封装描述 | CHIP, 1008, ROHS COMPLIANT | CHIP, 1008, ROHS COMPLIANT | CHIP, 1008, ROHS COMPLIANT | CHIP, 1008, ROHS COMPLIANT | CHIP, 1008, ROHS COMPLIANT | CHIP, 1008, ROHS COMPLIANT | - | - | ROHS COMPLIANT, 塑料 PACKAGE-3 |
欧盟RoHS规范 | Yes | Yes | Yes | Yes | Yes | Yes | - | - | - |
状态 | EOL | EOL | EOL | EOL | EOL | EOL | - | - | ACTIVE |
电感类型 | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | GENERAL PURPOSE INDUCTOR | - | - | - |
case_size_code | 1008 | 1008 | 1008 | 1008 | 1008 | 1008 | - | - | - |
结构 | Molded Chip | Molded Chip | Molded Chip | Molded Chip | Molded Chip | Molded Chip | - | - | 单一的 |
核心材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | - | - | - |
直流电阻 | 4 ohm | 4 ohm | 4 ohm | 4 ohm | 4 ohm | 4 ohm | - | - | - |
电感应用 | RF INDUCTOR | RF INDUCTOR | RF INDUCTOR | RF INDUCTOR | RF INDUCTOR | RF INDUCTOR | - | - | - |
jesd_609_code | e2 | e2 | e2 | e2 | e2 | e2 | - | - | - |
制造商系列 | PC | PC | PC | PC | PC | PC | - | - | - |
ckage_heigh | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | - | - | - |
ckage_length | 2.5 mm | 2.5 mm | 2.5 mm | 2.5 mm | 2.5 mm | 2.5 mm | - | - | - |
ckage_style__meter_ | SMT | SMT | SMT | SMT | SMT | SMT | - | - | - |
ckage_width | 2 mm | 2 mm | 2 mm | 2 mm | 2 mm | 2 mm | - | - | - |
cking_method | TR | TR | TR | TR | TR | TR | - | - | - |
1额定值的最小品质因数 | 20 | 20 | 20 | 20 | 20 | 20 | - | - | - |
最大额定电流 | 0.1600 A | 0.1600 A | 0.1600 A | 0.1600 A | 0.1600 A | 0.1600 A | - | - | - |
series | ELJ-P | ELJ-P | ELJ-P | ELJ-P | ELJ-P | ELJ-P | - | - | - |
形状大小描述 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | - | - | - |
隔离 | NO | NO | NO | NO | NO | NO | - | - | - |
表面贴装 | YES | YES | YES | YES | YES | YES | - | - | Yes |
端子涂层 | TIN COPPER | TIN COPPER | TIN COPPER | TIN COPPER | TIN COPPER | TIN COPPER | - | - | - |
端子布局 | DUAL ENDED | DUAL ENDED | DUAL ENDED | DUAL ENDED | DUAL ENDED | DUAL ENDED | - | - | - |
端子形状 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | - | - | - |
测试频率 | 2.52 MHz | 2.52 MHz | 2.52 MHz | 2.52 MHz | 2.52 MHz | 2.52 MHz | - | - | - |
偏差 | 10 % | 10 % | 10 % | 10 % | 10 % | 10 % | - | - | - |
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