IC HC/UH SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT457, SC-74, TSOP-6, Gate
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | NXP(恩智浦) |
零件包装代码 | TSOP |
包装说明 | PLASTIC, SOT457, SC-74, TSOP-6 |
针数 | 6 |
Reach Compliance Code | unknown |
系列 | HC/UH |
JESD-30 代码 | R-PDSO-G6 |
JESD-609代码 | e3 |
长度 | 2.8 mm |
逻辑集成电路类型 | BUFFER |
湿度敏感等级 | 1 |
功能数量 | 2 |
输入次数 | 1 |
端子数量 | 6 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 125 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子面层 | TIN |
端子形式 | GULL WING |
端子节距 | 0.95 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 1.5 mm |
74HC2G34GV-G | 74HC2G34GV-Q100H | 74HCT2G34GV-Q100H | 74HCT2G34GW,132 | 74HCT2G34GW-G | 74HCT2G34GV-G | 74HC2G34GW-G | |
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描述 | IC HC/UH SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT457, SC-74, TSOP-6, Gate | buffers & line drivers dual buffer gate | buffers & line drivers dual buffer gate | Buffer, HCT Series, 2-Func, 1-Input, CMOS, PDSO6 | IC HCT SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT363, SC-88, 6 PIN, Gate | IC HCT SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT457, SC-74, TSOP-6, Gate | IC HC/UH SERIES, DUAL 1-INPUT NON-INVERT GATE, PDSO6, PLASTIC, SOT363, SC-88, 6 PIN, Gate |
厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
包装说明 | PLASTIC, SOT457, SC-74, TSOP-6 | PLASTIC, SC-74, SOT-457, TSOP-6 | PLASTIC, SC-74, SOT-457, TSOP-6 | TSSOP, | PLASTIC, SOT363, SC-88, 6 PIN | PLASTIC, SOT457, SC-74, TSOP-6 | PLASTIC, SOT363, SC-88, 6 PIN |
Reach Compliance Code | unknown | compli | compli | unknown | unknown | unknown | unknown |
是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | 符合 | 符合 |
零件包装代码 | TSOP | TSOP | TSOP | - | SOT-363 | TSOP | SOT-363 |
针数 | 6 | 6 | 6 | - | 6 | 6 | 6 |
系列 | HC/UH | - | - | HCT | HCT | HCT | HC/UH |
JESD-30 代码 | R-PDSO-G6 | - | - | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-G6 |
JESD-609代码 | e3 | - | - | - | e3 | e3 | e3 |
长度 | 2.8 mm | - | - | 2 mm | 2 mm | 2.8 mm | 2 mm |
逻辑集成电路类型 | BUFFER | - | - | BUFFER | BUFFER | BUFFER | BUFFER |
湿度敏感等级 | 1 | - | - | - | 1 | 1 | 1 |
功能数量 | 2 | - | - | 2 | 2 | 2 | 2 |
输入次数 | 1 | - | - | 1 | 1 | 1 | 1 |
端子数量 | 6 | - | - | 6 | 6 | 6 | 6 |
最高工作温度 | 125 °C | - | - | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | - | - | TSSOP | TSSOP | TSSOP | TSSOP |
封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 260 | - | - | - | 260 | 260 | 260 |
传播延迟(tpd) | 125 ns | - | - | 29 ns | 29 ns | 29 ns | 125 ns |
认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.1 mm | - | - | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
最大供电电压 (Vsup) | 6 V | - | - | 5.5 V | 5.5 V | 5.5 V | 6 V |
最小供电电压 (Vsup) | 2 V | - | - | 4.5 V | 4.5 V | 4.5 V | 2 V |
标称供电电压 (Vsup) | 5 V | - | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | - | - | YES | YES | YES | YES |
技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | - | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子面层 | TIN | - | - | - | TIN | TIN | TIN |
端子形式 | GULL WING | - | - | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.95 mm | - | - | 0.65 mm | 0.65 mm | 0.95 mm | 0.65 mm |
端子位置 | DUAL | - | - | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 30 | - | - | - | 30 | 30 | 30 |
宽度 | 1.5 mm | - | - | 1.25 mm | 1.25 mm | 1.5 mm | 1.25 mm |
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