Connectivity and Integration
D e l p h i
M i n i
U S B
C o n n e c t o r s
Description –
Board mount I/O connectors for the industry
standard USB (Universal Serial Bus) interface used to connect
high speed peripheral devices to computers. Mini USBs are
ideal for applications that require small, lightweight connectors.
Typical Applications –
Desktop and notebook computers
PDAs, cell phones
Portable music recorders/players
Benefits/Features:
Digital cameras
External disk drives
Industry Standard . .Meets the speed requirements of USB 2.0.
. . . . . . . . . . . . . .Meets
preliminary requirements of USB
. . . . . . . . . . . . . .OTG
(On-The-Go).
Flexible System . . .SMT and through hole mounting styles are
. . . . . . . . . . . . . .available.
. . . . . . . . . . . . . .Allows
for hot plugging of multiple devices.
Ruggedness
and Reliability . . . .Full metal shields help protect contacts from
. . . . . . . . . . . . . .physical
and ESD (Electro Static Discharge)
. . . . . . . . . . . . . .damage.
. . . . . . . . . . . . . .High
cycle life versions are available.
Selectable Features
Product Type
Total No. of Positions
Centerline Spacing
Orientation
Mounting Style
Operating Voltage
PCB Thickness
Contact Style
Contact Area Plating
Height Above Board
Shell (Shield) Material
Housing Color
Mini B USB receptacles
5
0.8 mm [.0315 in.]
Horizontal
DIP or SMT
30 VAC RMS
SMT: N/A, TH: 0.8 mm [.0315 in.]
Formed
Gold plated (see product print for thickness)
4 mm [.16 in.]
Brass
Black
Other Properties
Packaging Type
Housing Material
Applicable Soldering Process
Contact Base Material
Insulation Resistance
Withstanding Voltage
Current Rating
Contact Resistance
Temperature Range
Normal Force
Durability (Mating Cycles)
Mating Force
Unmating Force
Plating (Contact Area)
Plating (Soldering End)
Plating (Shield)
Underplating
Standards
SMT: tape and reel, Through hole: tray
Nylon GF
IR, vapor phase, wave
Phosphor bronze
100 MΩ initial
100 VAC RMS
1 amp max. per contact
30 mΩ
-25°C to +70°C
30 g min. (controlled by cable connector)
5000 cycles
35 N [7 lbf] max.
.9
7 N [1.6 lbf] min. initial
Gold (thickness varies per Delphi spec.)
over nickel underplating
2.03 µm [80 µin.] min. tin-lead over nickel
underplating
2.03 µm [80 µin.] min. tin-lead over nickel
underplating
1.27 µm [50 µin.] nickel
Universal Serial Bus Revision 2.0 Specification
USB 2.0 Specification ECN #1: Mini B
Connector
UL approved
Approvals and Certification
www.delphi.com/connect
Connection Systems
19200 Asheville Highway
P
.O. Box 519, Landrum, SC 29356 U.S.A.
Tel: [1] 864.457.3824
Fax: [1] 864.457.2535
D e l p h i
M i n i
U S B
C o n n e c t o r s
Ordering Nomenclature
1543 0262 – 1 0 0
Selective Plating:
Gold plated on contact area and 2.54 µm [100
µin.] min. tin-lead plated on soldering end over
1.27 µm [50 µin.] min. nickel underplating
1
= Gold Flash
2
= 0.381 µm [15 µin.]
3
= 0.762 µm [30 µin.]
Surface Mount . .
1543
0262
Through Hole . . .
1543
0384
SMT
Through
Hole
Dimensions are in millimeters and [inches].
Printed on Recycled Paper
© 2004 Delphi. All rights reserved.
DP-04-E-066
802/GBS • U803/3W • U1104/3W
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