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CHP1X-100-2201-G-7

产品描述RESISTOR, METAL GLAZE/THICK FILM, 1W, 2%, 100ppm, 2200ohm, SURFACE MOUNT, 2010, MELF
产品类别无源元件    电阻器   
文件大小209KB,共2页
制造商TT Electronics plc
官网地址http://www.ttelectronics.com/
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CHP1X-100-2201-G-7概述

RESISTOR, METAL GLAZE/THICK FILM, 1W, 2%, 100ppm, 2200ohm, SURFACE MOUNT, 2010, MELF

CHP1X-100-2201-G-7规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称TT Electronics plc
包装说明MELF, 2010
Reach Compliance Codecompliant
构造Cylindrical
JESD-609代码e0
安装特点SURFACE MOUNT
端子数量2
最高工作温度150 °C
封装直径2.01 mm
封装长度5.08 mm
封装形状CYLINDRICAL PACKAGE
封装形式MELF
包装方法TR, 7 INCH
额定功率耗散 (P)1 W
额定温度70 °C
电阻2200 Ω
电阻器类型FIXED RESISTOR
尺寸代码2010
表面贴装YES
技术METAL GLAZE/THICK FILM
温度系数100 ppm/°C
端子面层Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
端子形状WRAPAROUND
容差2%
工作电压300 V
Base Number Matches1

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Metal Glaze™ Cylindrical
Official Size
Power Resistor
CHP1X Series
0.1 ohm to 10K ohm
Outstanding surge capacity
1W in a 1/2W package (2010 footprint)
150°C maximum operating temperature
Metal Glaze
thick film
element fired at 1000°C to
solid ceramic substrate
High Purity ceramic
core for optimal
thermal
distribution
High temperature
dielectric coating
60/40 Solder over
nickel barrier
Electrical Data
Size
Code¹
D
Industry
Footprint
2010
IRC
Type
CHP 1X
Maximum
Power Rat-
ing
1W @ 70°C
Working
Voltage²
300
Maximum
Voltage
600
Resistance
Range (ohms)³
0.1 to 0.99
1.0 to 10K
Tolerance
(±%)³
1, 2, 5
1, 2, 5
TCR
(±%)³
100
50, 100
Product Category
Low Range
Standard
² Not to exceed
P x R
³ Consult factory for tighter TCR, tolerance, or resistance values
Environmental Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specified
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
±0.5% + 0.01 ohm
±1% for R>100K ohm
±0.5% + 0.01 ohm
±0.25% + 0.01 ohm
95% minimum coverage
±0.5% + 0.01 ohm
±0.3% + 0.01 ohm
±1% + 0.01 ohm
no mechanical damage
±1% + 0.01 ohm
no mechanical damage
Test Method
MIL-R-55342E Par 4.7.9 (-55°C + 125°C)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5
2.5 x
P x R for 5 seconds
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board at
260°C for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
1200 gram push from underside of mounted chip for
60 seconds
Chip mounted in center of 90mm long board, deflected
5mm so as to exert pull on chip contacts for 10 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
CHP1X Series Issue September 2008 Sheet 1 of 2

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