IC AHC/VHC/H/U/V SERIES, 8-INPUT NAND GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14, Gate
| 参数名称 | 属性值 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| 系列 | AHC/VHC/H/U/V |
| JESD-30 代码 | R-PQCC-N14 |
| 长度 | 3 mm |
| 逻辑集成电路类型 | NAND GATE |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装形状 | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 传播延迟（tpd） | 15.5 ns |
| 筛选级别 | AEC-Q100 |
| 座面最大高度 | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 2.5 mm |
| 74AHC30BQ-Q100 | 74AHC30D-Q100 | 74AHC30PW-Q100 | 74AHCT30BQ-Q100 | 74AHCT30D-Q100 | 74AHCT30PW-Q100 | |
|---|---|---|---|---|---|---|
| 描述 | IC AHC/VHC/H/U/V SERIES, 8-INPUT NAND GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14, Gate | IC AHC/VHC/H/U/V SERIES, 8-INPUT NAND GATE, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14, Gate | IC AHC/VHC/H/U/V SERIES, 8-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14, Gate | IC AHCT/VHCT/VT SERIES, 8-INPUT NAND GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT762-1, DHVQFN-14, Gate | IC AHCT/VHCT/VT SERIES, 8-INPUT NAND GATE, PDSO14, 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14, Gate | IC AHCT/VHCT/VT SERIES, 8-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14, Gate |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | QFN | SOIC | TSSOP | QFN | SOIC | TSSOP |
| 包装说明 | HVQCCN, | SOP, | TSSOP, | HVQCCN, | SOP, | TSSOP, |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHCT/VHCT/VT | AHCT/VHCT/VT | AHCT/VHCT/VT |
| JESD-30 代码 | R-PQCC-N14 | R-PDSO-G14 | R-PDSO-G14 | R-PQCC-N14 | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 3 mm | 8.65 mm | 5 mm | 3 mm | 8.65 mm | 5 mm |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVQCCN | SOP | TSSOP | HVQCCN | SOP | TSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 15.5 ns | 15.5 ns | 15.5 ns | 10.5 ns | 10.5 ns | 10.5 ns |
| 筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| 座面最大高度 | 1 mm | 1.75 mm | 1.1 mm | 1 mm | 1.75 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | NO LEAD | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 1.27 mm | 0.65 mm | 0.5 mm | 1.27 mm | 0.65 mm |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | DUAL | DUAL |
| 宽度 | 2.5 mm | 3.9 mm | 4.4 mm | 2.5 mm | 3.9 mm | 4.4 mm |
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