epitex
Opto-Device & Custom LED
SMD TYPE LED SMT735/850
Lead ( Pb ) Free Product – RoHS Compliant
SMT735/850
High Performance Bi-color TOP LED
Bi-color LED of SMT735/850 consists of DDH AlGaAs LEDs mounted on the lead frame
as TOP LED package and is sealed with epoxy resin.
It emits a spectral band of radiation at 735nm and 850nm at anode common.
Outer
dimension (Unit: mm)
Specifications
1) Product Name
2) Type No.
3) Chip
(1) Chip Material
(2) Peak Wavelength
4) Package
(1) Lead Frame Die
(2) Package Resin
(3) Lens
Bi-color TOP LED
SMT735/850
AlGaAs
735nm/850nm
Silver Plated
PPA Resin
Epoxy Resin
Absolute
Maximum Ratings
Maximum Rated Value
Unit
Ambient Temperature
735nm
850nm
Power Dissipation
P
D
165
150
mW
Ta=25°C
Forward Current
I
F
75
75
mA
Ta=25°C
Pulse Forward Current
I
FP
300
500
mA
Ta=25°C
Reverse Voltage
V
R
5
V
Ta=25°C
Junction Temperature
T
J
100
°C
Thermal Resistance
R
thja
190
K/W
Operating Temperature
T
OPR
-20 ~ +80
°C
-30 ~ +80
°C
Storage Temperature
T
STG
Soldering Temperature
T
SOL
250
°C
‡
Pulse Forward Current condition: Duty=1% and Pulse Width=10us.
‡Soldering condition: Soldering condition must be completed within 5 seconds at 250°C
Item
Symbol
Electro-Optical
Characteristics [Ta=25°C]
Minimum
Typical
Maximum
Unit
735nm 850nm 735nm 850nm 735nm 850nm
Forward Voltage
V
F
I
F
=50mA
1.85 1.60
2.10
1.80
V
Reverse Current
I
R
V
R
=5V
10
uA
10.0 10.0 18.0
Total Radiated Power P
O
I
F
=50mA 5.0
mW
2
5.0
5.0
7.0
Radiant Intensity
I
E
I
F
=50mA
mW/sr
735
850
I
F
=50mA
Peak Wavelength
nm
P
20
35
Half Width
I
F
=50mA
nm
Viewing Half Angle
±55
deg.
I
F
=50mA
‡Total Radiated Power is measured by Photodyne #500
‡Brightness is measured by Tektronix J-16.
Item
Symbol Condition
EPITEX INC.: 66-3 Minami-Kawabe Cho, Higashi-Kujyo, Minami-Ku, Kyoto, Japan
Tel: ++81-75-682-2338
Fax: ++81-75-682-2267
e-mail: sales-dep@epitex.com
http://www.epitex.com
epitex
SMD
Application
300
250
Temperature [°C]
200
150
100
50
0
0
60s
50
Opto-Device & Custom LED
TOP IR LED SMT735/850
Lead ( Pb ) Free Product – RoHS Compliant
Recommended reflow soldering profile
Recommended Land Layout (Unit: mm)
250°C
200°C
150°C
MAX 5s
120s
100
150
Time [s]
40s
200
70s
250
300
Don’t put stress on SMD and a circuit board after soldering.
SMD
Packing
Tape and Reel Dimensions (Unit: mm)
Wrapping
Moisture barrier bag aluminum laminated film with a desiccant to keep out the moisture absorption
during the transportation and storage.
EPITEX INC.: 66-3 Minami-Kawabe Cho, Higashi-Kujyo, Minami-Ku, Kyoto, Japan
Tel: ++81-75-682-2338
Fax: ++81-75-682-2267
e-mail: sales-dep@epitex.com
http://www.epitex.com
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