Buffer, 10H Series, 6-Func, 1-Input, ECL, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Motorola ( NXP ) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | STROBED OUTPUTS |
| 控制类型 | ENABLE HIGH |
| 系列 | 10H |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.885 mm |
| 逻辑集成电路类型 | BUFFER |
| 位数 | 6 |
| 功能数量 | 6 |
| 输入次数 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-EMITTER |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 最大电源电流（ICC） | 46 mA |
| 传播延迟（tpd） | 1.9 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 1.9 mm |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.885 mm |
| Base Number Matches | 1 |
| 5962-87509012A | 10H588/BEAJC | GRM0222C1H7R5DA03 | GRM0222C1H7R6WA03 | 5962-8750901EA | 5962-8750901FA | |
|---|---|---|---|---|---|---|
| 描述 | Buffer, 10H Series, 6-Func, 1-Input, ECL, CQCC20, CERAMIC, LCC-20 | 10H SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP16, CERDIP-16 | Chip Multilayer Ceramic Capacitors for General Purpose | Chip Multilayer Ceramic Capacitors for General Purpose | 10H SERIES, HEX 1-INPUT NON-INVERT GATE, CDIP16, CERDIP-16 | Buffer, 10H Series, 6-Func, 1-Input, ECL, CDFP16, CERAMIC, FP-16 |
| 包装说明 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | - | - | DIP, | DFP, FL16,.3 |
| Reach Compliance Code | unknown | unknown | - | - | unknown | unknown |
| 其他特性 | STROBED OUTPUTS | STROBED OUTPUTS | - | - | STROBED OUTPUTS | STROBED OUTPUTS |
| 系列 | 10H | 10H | - | - | 10H | 10H |
| JESD-30 代码 | S-CQCC-N20 | R-GDIP-T16 | - | - | R-GDIP-T16 | R-GDFP-F16 |
| JESD-609代码 | e0 | e0 | - | - | e0 | e0 |
| 长度 | 8.885 mm | 19.495 mm | - | - | 19.49 mm | 9.65 mm |
| 逻辑集成电路类型 | BUFFER | BUFFER | - | - | BUFFER | BUFFER |
| 功能数量 | 6 | 6 | - | - | 6 | 6 |
| 输入次数 | 1 | 1 | - | - | 1 | 1 |
| 端子数量 | 20 | 16 | - | - | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | - | - | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | - | -55 °C | -55 °C |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | - | - | OPEN-EMITTER | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | - | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | DIP | - | - | DIP | DFP |
| 封装形状 | SQUARE | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | - | - | IN-LINE | FLATPACK |
| 最大电源电流（ICC） | 46 mA | 46 mA | - | - | 46 mA | 46 mA |
| 传播延迟（tpd） | 1.9 ns | 1.9 ns | - | - | 1.9 ns | 1.9 ns |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.9 mm | 5.08 mm | - | - | 5.08 mm | 2.15 mm |
| 表面贴装 | YES | NO | - | - | NO | YES |
| 技术 | ECL | ECL | - | - | ECL | ECL |
| 温度等级 | MILITARY | MILITARY | - | - | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | - | - | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | - | - | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | - | - | DUAL | DUAL |
| 宽度 | 8.885 mm | 7.62 mm | - | - | 7.62 mm | 6.415 mm |
| Base Number Matches | 1 | 1 | - | - | 1 | 1 |
PCB设计
FPGA/CPLD
NXP MCU
微控制器 MCU
stm32/stm8
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