Registered Bus Transceiver, 1-Func, 8-Bit, Inverted Output, CDFP24,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DFP, FL24,.4 |
| Reach Compliance Code | unknown |
| 控制类型 | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL |
| JESD-30 代码 | R-XDFP-F24 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
| 最大I（ol） | 0.048 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| 最大电源电流（ICC） | 30 mA |
| Prop。Delay @ Nom-Sup | 8.4 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| Base Number Matches | 1 |
| 54ABT648/B3A | 54ABT648/BKA | 54ABT648/BLA | |
|---|---|---|---|
| 描述 | Registered Bus Transceiver, 1-Func, 8-Bit, Inverted Output, CDFP24, | Registered Bus Transceiver, 1-Func, 8-Bit, Inverted Output, CQCC28 | Registered Bus Transceiver, 1-Func, 8-Bit, Inverted Output, CDIP24, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | DFP, FL24,.4 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 |
| Reach Compliance Code | unknown | unknown | unknown |
| 控制类型 | INDEPENDENT CONTROL | INDEPENDENT CONTROL | INDEPENDENT CONTROL |
| 计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 代码 | R-XDFP-F24 | S-XQCC-N28 | R-XDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 |
| 逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
| 最大I（ol） | 0.048 A | 0.048 A | 0.048 A |
| 位数 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 24 | 28 | 24 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DFP | QCCN | DIP |
| 封装等效代码 | FL24,.4 | LCC28,.45SQ | DIP24,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | CHIP CARRIER | IN-LINE |
| 电源 | 5 V | 5 V | 5 V |
| 最大电源电流（ICC） | 30 mA | 30 mA | 30 mA |
| Prop。Delay @ Nom-Sup | 8.4 ns | 8.4 ns | 8.4 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | NO LEAD | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Base Number Matches | 1 | 1 | 1 |
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