OR/NOR Gate, 10H Series, 2-Func, 5-Input, ECL, CDFP16, CERAMIC, FP-16
| 参数名称 | 属性值 |
| 厂商名称 | Motorola ( NXP ) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 其他特性 | ASYMMETRICAL INPUTS |
| 系列 | 10H |
| JESD-30 代码 | R-GDFP-F16 |
| JESD-609代码 | e0 |
| 长度 | 9.65 mm |
| 逻辑集成电路类型 | OR/NOR GATE |
| 功能数量 | 2 |
| 输入次数 | 5 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 最大电源电流(ICC) | 16 mA |
| 传播延迟(tpd) | 1.6 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.15 mm |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.415 mm |
| Base Number Matches | 1 |
| 5962-8985601FA | GRM0222C1H5R6DA03 | 5962-8985601EA | 5962-89856012A | |
|---|---|---|---|---|
| 描述 | OR/NOR Gate, 10H Series, 2-Func, 5-Input, ECL, CDFP16, CERAMIC, FP-16 | Chip Multilayer Ceramic Capacitors for General Purpose | OR/NOR Gate, 10H Series, 2-Func, 5-Input, ECL, CDIP16, CERDIP-16 | OR/NOR Gate, 10H Series, 2-Func, 5-Input, ECL, CQCC20, CERAMIC, LCC-20 |
| 包装说明 | DFP, | - | DIP, DIP16,.3 | QCCN, |
| Reach Compliance Code | unknown | - | unknown | unknown |
| 其他特性 | ASYMMETRICAL INPUTS | - | ASYMMETRICAL INPUTS | ASYMMETRICAL INPUTS |
| 系列 | 10H | - | 10H | 10H |
| JESD-30 代码 | R-GDFP-F16 | - | R-GDIP-T16 | S-CQCC-N20 |
| JESD-609代码 | e0 | - | e0 | e0 |
| 长度 | 9.65 mm | - | 19.49 mm | 8.885 mm |
| 逻辑集成电路类型 | OR/NOR GATE | - | OR/NOR GATE | OR/NOR GATE |
| 功能数量 | 2 | - | 2 | 2 |
| 输入次数 | 5 | - | 5 | 5 |
| 端子数量 | 16 | - | 16 | 20 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C |
| 输出特性 | OPEN-EMITTER | - | OPEN-EMITTER | OPEN-EMITTER |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | - | DIP | QCCN |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | - | IN-LINE | CHIP CARRIER |
| 最大电源电流(ICC) | 16 mA | - | 16 mA | 16 mA |
| 传播延迟(tpd) | 1.6 ns | - | 1.6 ns | 1.6 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 2.15 mm | - | 5.08 mm | 1.9 mm |
| 表面贴装 | YES | - | NO | YES |
| 技术 | ECL | - | ECL | ECL |
| 温度等级 | MILITARY | - | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | - | Tin/Lead (Sn/Pb) | TIN LEAD |
| 端子形式 | FLAT | - | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | - | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | QUAD |
| 宽度 | 6.415 mm | - | 7.62 mm | 8.885 mm |
| Base Number Matches | 1 | - | 1 | 1 |
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