REVISIONS
LTR
A
B
DESCRIPTION
Add "Changes in accordance with NOR 5962-R115-92."
Add software data protection. Increase data retention to 20 years,
minimum. Add device types 08 through 16. Remove tests t
DHWL
,
t
WHDX
, and ESDS requirements from drawing.
Add "Changes in accordance with NOR 5962-R071-95."
Updated boilerplate paragraphs. ksr
DATE (YR-MO-DA)
92-01-27
93-07-21
APPROVED
M. A. Frye
M. A. Frye
C
D
95-02-14
05-04-15
M. A. Frye
Raymond Monnin
The original first page has been replaced.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
D
17
D
18
REV
SHEET
PREPARED BY
Kenneth Rice
D
19
D
20
D
21
D
1
D
22
D
2
D
23
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
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D
14
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
CHECKED BY
Raymond Monnin
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
88-08-29
MICROCIRCUIT, MEMORY,
DIGITAL, CMOS 32K X 8
EEPROM, MONOLITHIC
SILICON
SIZE
A
SHEET
CAGE CODE
REVISION LEVEL
D
67268
1 OF
23
5962-88525
5962-E286-05
DSCC FORM 2233
APR 97
.
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88525
⏐
⏐
⏐
⏐
Drawing number
01
⏐
⏐
⏐
⏐
Device type
(see 1.2.1)
X
⏐
⏐
⏐
⏐
Case outline
(see 1.2.2)
A
⏐
⏐
⏐
⏐
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
Generic number
See 6.6
Access
Circuit function
time
Write
speed
Write
mode
End of Write
Indicator
Software data
Endurance
protect
No
No
No
No
No
No
No
No
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
(32K X 8 EEPROM) 350 ns 10 ms byte/page
300 ns 10 ms byte/page
250 ns 10 ms byte/page
200 ns 10 ms byte/page
250 ns 10 ms byte/page
150 ns 10 ms byte/page
150 ns 3 ms byte/page
150 ns 10 ms byte/page
350 ns 10 ms byte/page
300 ns 10 ms byte/page
250 ns 10 ms byte/page
200 ns 10 ms byte/page
250 ns 10 ms byte/page
150 ns 10 ms byte/page
150 ns 3 ms byte/page
150 ns 10 ms byte/page
DATA
polling 10,000 cycles
DATA
polling 10,000 cycles
DATA
polling 10,000 cycles
DATA
polling 10,000 cycles
DATA
polling 100,000 cycles
DATA
polling 10,000 cycles
DATA
polling 10,000 cycles
DATA
polling 100,000 cycles
DATA
polling 10,000 cycles
DATA
polling 10,000 cycles
DATA
polling 10,000 cycles
DATA
polling 10,000 cycles
DATA
polling 100,000 cycles
DATA
polling 10,000 cycles
DATA
polling 10,000 cycles
DATA
polling 100,000 cycles
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
U
X
Y
Z
Descriptive designator
See figure 1
GDIPI-T28 or CDIP2-T28
CQCC1-N32
CDFP4-F28
Terminals
128
28
32
28
Package style
Grid array
Dual-in-line
Rectangular leadless chip carrier
Flat package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88525
SHEET
D
2
1.3 Absolute maximum ratings.
1/
-0.3 V dc to +6.25 V dc
-65°C to +150°C
1.0 W
+300°C
+175°C
See MIL-STD-1835
-0.3 V dc to +6.25 V dc
10 years (minimum)
10,000 cycles/byte (minimum)
100,000 cycles/byte (minimum)
15.0 V dc
Supply voltage range (V
CC
) ............................................................................
Storage temperature range ............................................................................
Maximum power dissipation (P
D
)....................................................................
Lead temperature (soldering, 10 seconds) .....................................................
Junction temperature (T
J
) 2/...........................................................................
Thermal resistance, junction-to-case (Θ
JC
).....................................................
Input voltage range (V
IL
, V
IH
) ..........................................................................
Data retention.................................................................................................
Endurance:
Types 01-04, 06, 07, 09-12, 14, 15 ..............................................................
Types 05, 08, 13 ,16.....................................................................................
Chip clear voltage (V
H
) ...................................................................................
1.4 Recommended operating conditions. 1/
Supply voltage range (V
CC
) ............................................................................
Case operating temperature range (T
C
) .........................................................
Input voltage, low range (V
IL
)..........................................................................
Input voltage, high range (V
IH
)........................................................................
2. APPLICABLE DOCUMENTS
+4.5 V dc to +5.5 V dc
-55°C to +125°C
-0.1 V dc to +0.8 V dc
+2.0 V dc to V
CC
+0.3 V dc
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
1/
2/
All voltages are referenced to V
SS
(ground).
Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88525
SHEET
D
3
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and on figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). See 3.2.3.1 and 3.2.3.2
3.2.3.1 Unprogrammed or erased devices. The truth table for unprogrammed devices shall be as specified on figure 3.
3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this drawing.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance
to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
3.10 Processing EEPROMS. All testing requirements and quality assurance provisions herein shall be satisfied by the
manufacturer prior to delivery.
3.10.1 Erasure of EEPROMS. When specified, devices shall be erased in accordance with the procedures and
characteristics specified in 4.4.3.
3.10.2 Programmability of EEPROMS. When specified, devices shall be programmed to the specified pattern using the
procedures and characteristics specified in 4.4.2. Software data protect procedures shall be as specified in 4.4.5.
3.10.3 Verification of erasure or programmability of EPROMS. When specified, devices shall be verified as either programmed
to the specified pattern or erased. As a minimum, verification shall consist of reading the device per the procedures and
characteristics specified in 4.4.4. Any bit that does not verify to be in the proper state shall constitute a device failure, and shall
be removed from the lot.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88525
SHEET
D
4
TABLE I. Electrical performance characteristics.
Test
│
│Symbol
│
│
│
│
│
│
│I
CC1
│
│
│
│
│
│I
CC2
│
│
│
│
│I
CC3
│
│
│
│
│I
IH
│
│
│I
IL
│
│
│I
OHZ
2/
│
│
│I
OLZ
2/
│
│
│V
IL
│
│
│V
IH
│
│
│V
OL
│
│
│
│V
OH
│
│
│
│I
OE
│
│
│
Conditions
│
-55°C
≤
T
C
≤+125°C
│
V
SS
= 0 V,
│
4.5 V
≤
V
CC
≤
5.5 V
│unless
otherwise specified 1/
│
│
│
CE = OE = V
IL
,
WE
= V
IH
│
all I/O's = 0 mA,
│Inputs
= V
CC
= 5.5 V,
│f
= 1/tAVAV (minimum)
│
│
│
CE = V
IH
, OE = V
IL
│
all I/O's = 0 mA
│Inputs
= V
CC
-0.3 V
│
│
│
CE = V
CC
-0.3 V
│
all I/O's = 0 mA,
│Inputs
= V
IL
to V
CC
-0.3 V
│
│
│V
IN
= 5.5 V
│
│
│V
IN
= 0.1 V
│
│
│V
OUT
= 5.5 V, CE = V
IH
│
│
│V
OUT
= 0.1 V, CE = V
IH
│
│
│
│
│
│
│
│
│I
OL
= 2.1 mA, V
IH
= 2.0 V
│V
CC
= 4.5 V, V
IL
= 0.8 V
│
│
│I
OH
= -400 µA, V
IH
= 2.0 V
│V
CC
= 4.5 V, V
IL
= 0.8 V
│
│
│V
H
= 13 V
│
│
│Group
A
│subgroups
│
│
│
│
│
│
1,2,3
│
│
│
│
│
│
1,2,3
│
│
│
│
│
1,2,3
│
│
│
│
│
1,2,3
│
│
│
1,2,3
│
│
│
1,2,3
│
│
│
1,2,3
│
│
│
1,2,3
│
│
│
1,2,3
│
│
│
1,2,3
│
│
│
│
1,2,3
│
│
│
│
1,2,3
│
│
│
│Device │
Limits
│types │
│
│
│
│
│
Min
│
Max
│
│
│
│
│
│
│
│
│
│
All
│
│
│
│
│
│
All
│
│
│
│
│
All
│
│
│
│
│
All
│
│
│
All
│
│
│
All
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
All
All
All
All
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
-10
│
│
│
-10
│
│
│
-10
│
│
│
-10
│
│
│-0.1
│
│
│
2.0
│
│
│
│
│
│
│
2.4
│
│
│
│
-10
│
│
80
│
│
│
│
│
│
3
│
│
│
│
│
350
│
│
│
│
│
10
│
│
│
10
│
│
│
10
│
│
│
10
│
│
│
0.8
│
│
│V
CC
│+
0.3V
│
│
0.45
│
│
│
│
│
│
│
│
100
│
│
│
│
│
│
│
│
│
Unit
Supply current
(active)
│
mA
│
│
│
│
│
│
mA
│
│
│
│
│
µA
│
│
│
│
│
µA
│
│
│
µA
│
│
│
µA
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
µA
V
V
V
Supply current
(TTL standby)
Supply current
(CMOS standby)
Input leakage (high)
Input leakage (low)
Output leakage (high)
Output leakage (low)
Input voltage low
Input voltage high
Output voltage low
Output voltage high
All
V
OE high leakage
(chip erase)
│
All
│
│
µA
│
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88525
SHEET
D
5
NXP MCU
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