HS-1254RH
PRELIMINARY
April 1998
Radiation Hardened, High Speed, Low Power
Dual Operational Amplifier with Disable
Description
The HS-1254RH is a
±5V,
Rad Hard, monolithic, dual,
current feedback amplifier that provides highly reliable
performance in harsh radiation environments. Dielectric
isolation and bonded wafer processing make this device
immune to latch-up (SEL).
Excellent dynamic characteristics, coupled with the disable
function, make this amplifier well-suited for a variety of satel-
lite system applications. The outputs have individual disable
control pins that make it easy to multiplex wideband signals,
putting the outputs in a high impedance mode and reducing
the supply current per op amp down to 3mA (typical).
Post radiation limits are fully specified and guaranteed to
300kRAD(Si) total dose to ensure predictable performance
in any space application.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC).
SMD numbers must be used when ordering.
Detailed Electrical Specifications for the HS-1254RH are
contained in SMD 5962-98581, which is easily down-
loadable from our website, via a DSCC “hot-link”.
http://www.semi.intersil.com/data/sm/index.htm
Features
• QML Qualified Per MIL-PRF-38535 Requirements
• Radiation Environment
- Total Dose . . . . . . . . . . . . . . . . . . . . . 3 x 10
5
RAD(Si)
- SEL Immune . . . . . . . . . . . Bonded Wafer DI Process
• Low Quiescent Current (per amp) . . . . . . 6.1mA (Max)
• Disabled Supply Current (per amp) . . . . . 4.0mA (Max)
• Low Offset Voltage. . . . . . . . . . . . . . . . . . . 5.0mV (Max)
• Output Enable/Disable Time . . . . . . . 160ns/20ns (Typ)
• High Slew Rate . . . . . . . . . . . . . . . . . . . 1050V/µs (Typ)
• Wide -3dB Bandwidth (A
V
= +2) . . . . . . . 530MHz (Typ)
Applications
• High Speed A/D Drivers
• Cable Drivers
• Wideband Signal Switching and Routing
• Redundant Circuit Multiplexing
• Pulse Amplifiers
Ordering Information
SMD PART NUMBER
5962R9858101VXC
N/A
INTERSIL PART NUMBER
HS9-1254RH-Q
HS9-1254RH/Sample
TEMP. RANGE (
o
C)
-55 to 125
25
PACKAGE
14 Ld Flatpack
14 Ld Flatpack
CASE OUTLINE
CDFP3-F14
CDFP3-F14
Pinout
HS-1254RH (FLATPACK)
TOP VIEW
-IN1
+IN1
DISABLE 1
V-
DISABLE 2
+IN2
-IN2
1
2
3
4
5
6
7
14
13
12
11
10
9
8
OUT1
NC
GND
V+
NC
NC
OUT2
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
©
Intersil Corporation 1999
File Number
4507
1
HS-1254RH
Die Characteristics
DIE DIMENSIONS
Size: 1750µm x 2330µm (69 mils x 92 mils)
Thickness: 483µm (19 mils)
GLASSIVATION
Type: Nitride
Thickness: 4k
Å
±
0.5k
Å
METALLIZATION
Metal 1
Type: AlCu(2%)/TiW
Thickness: 8k
Å
±
0.4k
Å
Metal 2
Type: AlCu(2%)
Thickness: 16k
Å
±
0.8k
Å
SUBSTRATE
DI, Bonded Wafer
BACKSIDE FINISH
Silicon
SUBSTRATE POTENTIAL
Floating (Recommend connection to V-)
TRANSISTOR COUNT:
180
Metallization Mask Layout
HS-1254RH
-IN1
OUT1
GND (SEE NOTE 1)
V+
+IN1
NC
DISABLE1
V-
DISABLE2
NC
+IN2
OUT2
-IN2
V-
NOTE:
1. This is an optional GND pad. Users may set a GND reference, via this pad, to ensure the TTL compatibility of the DISABLE inputs when
using asymmetrical supplies (e.g., V+ = 10V, V- = 0V).
2
HS-1254RH
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.
Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reli-
able. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (407) 724-7000
FAX: (407) 724-7240
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
ASIA
Intersil (Taiwan) Ltd.
Taiwan Limited
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
3
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
